Patent Assignment Details
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| Reel/Frame: | 038011/0291 | |
| Pages: | 12 |
| | Recorded: | 03/17/2016 | | |
| Attorney Dkt #: | 27257US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/06/2016
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Application #:
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14159237
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Filing Dt:
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01/20/2014
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Title:
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SEMICONDUCTOR DEVICE PACKAGE FORMED IN A CHIP-ON-WAFER LAST PROCESS USING THIN FILM ADHESIVES
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Assignee
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON STREET, 34TH FLOOR
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CHICAGO, IL 60661
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