Patent Assignment Details
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| Reel/Frame: | 038035/0461 | |
| Pages: | 3 |
| | Recorded: | 03/18/2016 | | |
| Attorney Dkt #: | 16548/1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/24/2018
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Application #:
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15023254
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Filing Dt:
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03/18/2016
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Publication #:
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Pub Dt:
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08/11/2016
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Title:
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METHOD FOR EVALUATING INTERNAL STRESS OF SILICON CARBIDE MONOCRYSTALLINE WAFER AND METHOD FOR PREDICTING WARPAGE IN SILICONE CARBIDE MONOCRYSTALLINE WAFER
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Assignee
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| 5319, OAZA YODO, YORII-MACHI, OSATO-GUN |
| SAITAMA, JAPAN 369-1201 |
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Correspondence name and address
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KENYON & KENYON LLP
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ONE BROADWAY
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NEW YORK, NY 10004
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