Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 038071/0837 | |
| Pages: | 7 |
| | Recorded: | 03/22/2016 | | |
| Attorney Dkt #: | 089994-0013 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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14915189
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Filing Dt:
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02/26/2016
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Publication #:
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Pub Dt:
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04/20/2017
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Title:
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SILVER BONDING WIRE FOR SEMICONDUCTOR DEVICE CONTAINING INDIUM, GALLIUM, AND/OR CADMIUM
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Assignees
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| 16-3, GINZA 7-CHOME, CHUO-KU |
| TOKYO, JAPAN 104-0061 |
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| 158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 358-0032 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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04/29/2024 02:02 PM
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