Patent Assignment Details
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| Reel/Frame: | 038084/0749 | |
| Pages: | 3 |
| | Recorded: | 03/23/2016 | | |
| Attorney Dkt #: | JINIP2016-01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/02/2018
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Application #:
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14909745
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Filing Dt:
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02/03/2016
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Publication #:
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Pub Dt:
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06/16/2016
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Title:
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ADDITIVE FOR REDUCING VOIDS AFTER ANNEALING OF COPPER PLATING WITH THROUGH SILICON VIA
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Assignee
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| NO. 3600, SIXIAN ROAD, SONGJIANG DISTRICT |
| SHANGHAI, CHINA |
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Correspondence name and address
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JIGANG JIN
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P.O. BOX 1455
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BURLINGAME, CA 94010-1455
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