Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 038090/0428 | |
| Pages: | 8 |
| | Recorded: | 03/24/2016 | | |
| Attorney Dkt #: | T&A-GENERAL/Z-2016-2 |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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09/09/1997
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Application #:
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08708559
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Filing Dt:
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09/06/1996
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Title:
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FLIP CHIP SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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11/30/1999
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Application #:
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09119045
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Filing Dt:
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07/20/1998
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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10/08/2002
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Application #:
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09417086
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Filing Dt:
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10/13/1999
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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| 9-1, SEIRAN 2-CHOME, OTSU-SHI |
| SHIGA, JAPAN |
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Correspondence name and address
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MATTINGLY & MALUR, PC
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1800 DIAGONAL ROAD
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SUITE 210
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ALEXANDRIA, VA 22314
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