Patent Assignment Details
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| Reel/Frame: | 038190/0192 | |
| Pages: | 7 |
| | Recorded: | 03/21/2016 | | |
| Attorney Dkt #: | 60059US02 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST ASSIGNOR EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 037915 FRAME: 0073. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/03/2017
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Application #:
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15052219
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Filing Dt:
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02/24/2016
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Publication #:
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Pub Dt:
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09/01/2016
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON ST., 34TH FLOOR
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CHICAGO, IL 60661
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