Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 038238/0934 | |
| Pages: | 3 |
| | Recorded: | 03/24/2016 | | |
| Attorney Dkt #: | 5649-4501 |
| Conveyance: | CONFIRMATORY PATENT ASSIGNMENT |
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Total properties:
2
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Patent #:
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Issue Dt:
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07/05/2005
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Application #:
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10016633
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Filing Dt:
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10/30/2001
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Publication #:
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Pub Dt:
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06/12/2003
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Title:
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WAFER SCRIBING METHOD AND WAFER SCRIBING DEVICE
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Patent #:
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Issue Dt:
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07/15/2003
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Application #:
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10112271
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Filing Dt:
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03/28/2002
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Publication #:
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Pub Dt:
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09/19/2002
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Title:
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METHOD FOR CLAMPING A SEMICONDUCTOR DEVICE IN A MANUFACTURING PROCESS
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Assignee
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| SAMSUNG-RO 129 (MAETAN-DONG) |
| YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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Correspondence name and address
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MBS/CANDI L. RIGGS
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4140 PARKLAKE AVENUE
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SUITE 600
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RALEIGH, NC 27612
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