Patent Assignment Details
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| Reel/Frame: | 038306/0587 | |
| Pages: | 10 |
| | Recorded: | 04/18/2016 | | |
| Attorney Dkt #: | TSMCP585USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/31/2018
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Application #:
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15088232
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Filing Dt:
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04/01/2016
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Publication #:
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Pub Dt:
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12/29/2016
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Title:
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BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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ESCHWEILER & ASSOCIATES, LLC.
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629 EUCLID AVENUE, SUITE 1000
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NATIONAL CITY BANK BUILDING
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CLEVELAND, OH 44114
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