Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 038323/0937 | |
| Pages: | 14 |
| | Recorded: | 04/19/2016 | | |
| Attorney Dkt #: | ARC920120094US2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/10/2018
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Application #:
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15133097
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Filing Dt:
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04/19/2016
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Publication #:
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Pub Dt:
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08/11/2016
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Title:
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INTERCONNECT CIRCUITS AT THREE DIMENSIONAL (3-D) BONDING INTERFACES OF A PROCESSOR ARRAY
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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SHERMAN IP LLP (IBM2/IBM2-S)
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1519 26TH STREET
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SANTA MONICA, CA 90404
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