Patent Assignment Details
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| Reel/Frame: | 038475/0900 | |
| Pages: | 4 |
| | Recorded: | 05/05/2016 | | |
| Attorney Dkt #: | YGUC.3931-002 (C1) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15075602
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Filing Dt:
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03/21/2016
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Publication #:
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Pub Dt:
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07/14/2016
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Title:
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SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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DONALD B. HASLETT/LAURA DONNELLEY
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CHERNOFF VILHAUER MCCLUNG & STENZEL LLP
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601 SW SECOND AVENUE, SUITE 1600
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PORTLAND, OR 97204
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