Patent Assignment Details
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| Reel/Frame: | 038630/0602 | |
| Pages: | 2 |
| | Recorded: | 05/18/2016 | | |
| Attorney Dkt #: | 106462.69121US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15037342
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Filing Dt:
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05/18/2016
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Publication #:
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Pub Dt:
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10/13/2016
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Title:
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Lead-Free Solder Alloy and Semiconductor Device
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Assignee
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| 6-6, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8280 |
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Correspondence name and address
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CROWELL & MORING LLP
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1001 PENNSYLVANIA AVENUE, NW
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WASHINGTON, DC 20004
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