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Reel/Frame:038653/0303   Pages: 7
Recorded: 05/20/2016
Attorney Dkt #:USP5783C/NB1827-SYO
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
15058109
Filing Dt:
03/01/2016
Publication #:
Pub Dt:
08/24/2017
Title:
Camera Module Based on Molding Technique and Molded Circuit Unit and Manufacturing Method Thereof
Assignors
1
Exec Dt:
03/11/2016
2
Exec Dt:
03/11/2016
3
Exec Dt:
03/11/2016
4
Exec Dt:
03/11/2016
5
Exec Dt:
03/11/2016
Assignee
1
66-68, SHUNYU ROAD, YUYAO,
NINGBO, ZHEJIANG, CHINA 315400
Correspondence name and address
DAVID AND RAYMOND PATENT FIRM
108 N. YNEZ AVE., SUITE 128
MONTEREY PARK, CA 91754

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