Patent Assignment Details
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Reel/Frame: | 038689/0944 | |
| Pages: | 8 |
| | Recorded: | 05/23/2016 | | |
Attorney Dkt #: | 25032US03 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/24/2017
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Application #:
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15162424
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Filing Dt:
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05/23/2016
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Title:
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Semiconductor Device Package and Manufacturing Method Thereof
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Assignee
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON ST., FLOOR 34
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CHICAGO, IL 60661
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