Patent Assignment Details
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| Reel/Frame: | 038706/0396 | |
| Pages: | 3 |
| | Recorded: | 05/24/2016 | | |
| Attorney Dkt #: | FIP-41035 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/17/2018
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Application #:
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15038939
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Filing Dt:
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05/24/2016
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Publication #:
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Pub Dt:
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01/05/2017
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Title:
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EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE
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Assignee
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| 3993 NIGORIKAWA, KITA-KU, NIIGATA-SHI |
| NIIGATA, JAPAN 950-3131 |
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Correspondence name and address
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RANKIN, HILL & CLARK LLP
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23755 LORAIN ROAD, SUITE 200
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NORTH OLMSTED, OH 44070
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