Patent Assignment Details
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| Reel/Frame: | 038760/0511 | |
| Pages: | 6 |
| | Recorded: | 06/01/2016 | | |
| Attorney Dkt #: | TSMCP718US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/30/2019
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Application #:
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15154289
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Filing Dt:
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05/13/2016
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Publication #:
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Pub Dt:
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11/16/2017
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Title:
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BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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ESCHWEILER & ASSOCIATES, LLC.
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629 EUCLID AVENUE, SUITE 1000
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NATIONAL CITY BANK BUILDING
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CLEVELAND, OH 44114
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