Patent Assignment Details
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| Reel/Frame: | 038899/0482 | |
| Pages: | 12 |
| | Recorded: | 06/13/2016 | | |
| Attorney Dkt #: | 1420149.366US9 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/09/2016
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Application #:
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13503126
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Filing Dt:
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08/03/2012
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Publication #:
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Pub Dt:
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12/19/2013
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Title:
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SUBSTRATE FOR POWER MODULE, SUBSTRATE WITH HEAT SINK FOR POWER MODULE, POWER MODULE, METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE WITH HEAT SINK FOR POWER MODULE
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Assignee
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| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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Correspondence name and address
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LOCKE LORD LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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