Patent Assignment Details
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| Reel/Frame: | 039044/0812 | |
| Pages: | 6 |
| | Recorded: | 06/29/2016 | | |
| Attorney Dkt #: | P160446US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/10/2018
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Application #:
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15196956
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Filing Dt:
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06/29/2016
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Publication #:
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Pub Dt:
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01/05/2017
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Title:
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WAFER PROCESSING TEMPORARY BONDING ARRANGEMENT, WAFER PROCESSING LAMINATE, AND THIN WAFER MANUFACTURING METHOD
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Assignee
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| 6-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN LLP
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1250 CONNECTICUT AVENUE NW,
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SUITE 700
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WASHINGTON, DC 20036
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