Patent Assignment Details
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| Reel/Frame: | 039123/0456 | |
| Pages: | 9 |
| | Recorded: | 07/11/2016 | | |
| Attorney Dkt #: | CH920160004US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/26/2018
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Application #:
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15206729
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Filing Dt:
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07/11/2016
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Publication #:
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Pub Dt:
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01/11/2018
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Title:
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Dense Assembly of Laterally Soldered, Overmolded Chip Packages
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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HARRINGTON & SMITH, ATTORNEYS AT LAW, LLC
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4 RESEARCH DRIVE, SUITE 202
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SHELTON, CT 06484-6212
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