Patent Assignment Details
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| Reel/Frame: | 039128/0010 | |
| Pages: | 7 |
| | Recorded: | 06/20/2016 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/29/2021
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Application #:
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15057078
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Filing Dt:
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02/29/2016
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Publication #:
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Pub Dt:
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08/24/2017
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Title:
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Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof
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Assignee
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| 66-68 SHUNYU ROAD, YUYAO |
| NINGBO, ZHEJIANG, CHINA 315400 |
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Correspondence name and address
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RAYMOND Y. CHAN
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SUITE 128
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108 N. YNEZ AVENUE
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MONTEREY PARK, CALIFORNIA 91754
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