Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 039268/0877 | |
| Pages: | 3 |
| | Recorded: | 07/27/2016 | | |
| Attorney Dkt #: | 2921.430USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/21/2012
|
Application #:
|
13171577
|
Filing Dt:
|
06/29/2011
|
|
Title:
|
WAFER LEVEL EMBEDDED AND STACKED DIE POWER SYSTEM-IN-PACKAGE PACKAGES
|
|
|
Assignee
|
|
|
|
|
| 1272 BORREGAS AVENUE |
| SUNNYVALE, CALIFORNIA 94089 |
|
|
Correspondence name and address
|
| |
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
|
| |
P.O. BOX 2938
|
| |
MINNEAPOLIS, MN 55402
|
Search Results as of:
05/16/2024 05:27 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
