Patent Assignment Details
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| Reel/Frame: | 039270/0825 | |
| Pages: | 5 |
| | Recorded: | 07/27/2016 | | |
| Attorney Dkt #: | 70027-1389 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/07/2018
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Application #:
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13844179
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Filing Dt:
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03/15/2013
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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WONG & REES LLP
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4677 OLD IRONSIDES DRIVE
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SUITE 370
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SANTA CLARA, CA 95054
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05/16/2024 03:49 PM
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