Patent Assignment Details
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| Reel/Frame: | 039338/0907 | |
| Pages: | 2 |
| | Recorded: | 07/14/2016 | | |
| Attorney Dkt #: | FSI-39491 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/11/2017
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Application #:
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15209964
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Filing Dt:
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07/14/2016
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Title:
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Method of Integrating a Copper Plating Process in a Through-Substrate-Via (TSV) on CMOS Wafer
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Assignee
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| 6501 WILLIAM CANNON DRIVE |
| AUSTIN, TEXAS 78735 |
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Correspondence name and address
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JERE L. POLMATIER
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WHYTE HIRSCHBOECK DUDEK S.C.
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555 EAST WELLS STREET, SUITE 1900
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MILWAUKEE, WI 53202
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