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Reel/Frame:039342/0923   Pages: 7
Recorded: 08/04/2016
Attorney Dkt #:SP349813US00
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/26/2019
Application #:
14220791
Filing Dt:
03/20/2014
Publication #:
Pub Dt:
10/02/2014
Title:
STACKED STRUCTURE HAVING A PROTECTIVE LAYER BETWEEN AN INSULATION LAYER AND WIRING
Assignor
1
Exec Dt:
07/27/2016
Assignee
1
4-14-1
ASAHI-CHO, ATSUGI-SHI
KANAGAWA, JAPAN
Correspondence name and address
CHIP LAW GROUP
155 N WACKER DR
CHICAGO, IL 60606

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