Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 039662/0473 | |
| Pages: | 4 |
| | Recorded: | 09/07/2016 | | |
| Attorney Dkt #: | 5355/0313PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/05/2017
|
Application #:
|
15245653
|
Filing Dt:
|
08/24/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/06/2017
| | | | |
|
Title:
|
Fan-Out Multi-Chip Package With Plurality Of Chips Stacked In Staggered Stack Arrangement
|
|
|
Assignee
|
|
|
|
|
| NO. 26, DATONG RD., HSINCHU SCIENCE PARK, HUKOU SHIANG |
| HSINCHU, TAIWAN |
|
|
Correspondence name and address
|
| |
MUNCY, GEISSLER, OLDS & LOWE, PC
|
| |
4000 LEGATO RD., SUITE 310
|
| |
FAIRFAX, VA 22033
|
Search Results as of:
05/22/2024 02:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
