Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 039676/0062 | |
| Pages: | 2 |
| | Recorded: | 09/08/2016 | | |
| Attorney Dkt #: | HOK-0642 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15124469
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Filing Dt:
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09/08/2016
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Publication #:
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Pub Dt:
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01/19/2017
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Title:
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PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD
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Assignee
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| 58, IJIRI, ISEDA-CHO |
| UJI-SHI, KYOTO, JAPAN 611-0043 |
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Correspondence name and address
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LEE CHENG
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1133 13TH STREET N.W. STE C2
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WASHINGTON, DC 20005
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05/02/2024 01:16 PM
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