Patent Assignment Details
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| Reel/Frame: | 039693/0189 | |
| Pages: | 12 |
| | Recorded: | 09/09/2016 | | |
| Attorney Dkt #: | NAUP2821USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/13/2018
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Application #:
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15261845
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Filing Dt:
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09/09/2016
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Publication #:
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Pub Dt:
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03/15/2018
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Title:
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SEMICONDUCTOR INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME
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Assignees
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| NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN |
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| 6TH FLOOR, PODIUM OF ELECTRIC POWER COMPANY BUILDING, MEILING STREET, JINJIANG CITY |
| QUANZHOU CITY, FUJIAN PROVINCE, CHINA |
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Correspondence name and address
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WINSTON HSU
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P.O.BOX 506
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MERRIFIELD, VA 22116
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