Patent Assignment Details
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| Reel/Frame: | 039951/0325 | |
| Pages: | 3 |
| | Recorded: | 10/06/2016 | | |
| Attorney Dkt #: | 36856.3596/KA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/11/2018
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Application #:
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15286601
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Filing Dt:
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10/06/2016
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Publication #:
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Pub Dt:
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01/26/2017
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Title:
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WIRELESS IC DEVICE, MOLDED RESIN ARTICLE, AND METHOD FOR MANUFACTURING WIRELESS IC DEVICE
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Assignee
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| 10-1 HIGASHIKOTARI 1-CHOME |
| NAGAOKAKYO-SHI, KYOTO-FU, JAPAN 617-8555 |
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Correspondence name and address
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KEATING & BENNETT LLP
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1800 ALEXANDER BELL DR.
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SUITE 200
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RESTON, VA 20191
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