Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 040032/0644 | |
| Pages: | 5 |
| | Recorded: | 10/17/2016 | | |
| Attorney Dkt #: | 091493-0025 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/16/2021
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Application #:
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15305238
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Filing Dt:
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10/19/2016
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Publication #:
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Pub Dt:
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02/09/2017
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignees
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| 16-3, GINZA 7-CHOME, CHUO-KU |
| TOKYO, JAPAN 104-0061 |
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| 158-1 OAZA SAYAMAGAHARA |
| IRUMA-SHI, SAITAMA, JAPAN 358-0032 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, NW
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WASHINGTON, DC 20001
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05/02/2024 02:23 PM
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