Patent Assignment Details
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| Reel/Frame: | 040140/0993 | |
| Pages: | 5 |
| | Recorded: | 10/26/2016 | | |
| Attorney Dkt #: | 2016-1449A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/12/2018
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Application #:
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15306812
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Filing Dt:
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10/26/2016
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Publication #:
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Pub Dt:
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02/16/2017
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Title:
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COPPER COMPOUND, STARTING MATERIAL FOR FORMING THIN FILM, AND METHOD FOR MANUFACTURING THIN FILM
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Assignee
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| 2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU |
| TOKYO, JAPAN 116-8554 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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1030 15TH STREET, NW
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SUITE 400 EAST
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WASHINGTON, DC 20005
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