Patent Assignment Details
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| Reel/Frame: | 040256/0591 | |
| Pages: | 6 |
| | Recorded: | 11/08/2016 | | |
| Attorney Dkt #: | Q222714 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/08/2019
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Application #:
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14927697
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Filing Dt:
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10/30/2015
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Publication #:
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Pub Dt:
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02/25/2016
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Title:
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ETCHING METHOD, ETCHING SOLUTION USED IN SAME, AND PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE PRODUCT
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Assignee
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| 26-30, NISHIAZABU 2-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 106-8620 |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, DC 20037
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