Patent Assignment Details
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| Reel/Frame: | 040326/0785 | |
| Pages: | 5 |
| | Recorded: | 11/15/2016 | | |
| Attorney Dkt #: | KAW11017P00050US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/17/2018
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Application #:
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15120482
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Filing Dt:
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08/19/2016
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Publication #:
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Pub Dt:
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03/16/2017
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Title:
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SILICONE-MODIFIED EPOXY RESIN, COMPOSITION CONTAINING SAID EPOXY RESIN, AND CURED PRODUCT THEREOF
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Assignees
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| 6-1, OHTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 1000004 |
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| 1-1, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 1000005 |
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Correspondence name and address
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WOOD, PHILLIPS, KATZ, CLARK & MORTIMER
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500 WEST MADISON STREET
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SUITE 1130
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CHICAGO, IL 60661
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