Patent Assignment Details
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| Reel/Frame: | 040328/0759 | |
| Pages: | 3 |
| | Recorded: | 11/15/2016 | | |
| Attorney Dkt #: | GRTGRN.001APC |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/28/2019
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Application #:
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15311152
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Filing Dt:
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11/14/2016
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Publication #:
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Pub Dt:
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06/08/2017
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Title:
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FULLY WAFER-LEVEL-PACKAGED MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| NO.268 DONGFANG ROAD |
| HI-TECH INDUSTRY DEVELOPMENT DISTRICT |
| WEIFANG, SHANDONG, CHINA 261031 |
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Correspondence name and address
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KNOBBE, MARTENS, OLSON & BEAR, LLP.
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2040 MAIN STREET, 14TH FLOOR
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IRVINE, CA 92614
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05/15/2024 08:42 AM
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