Patent Assignment Details
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| Reel/Frame: | 040419/0714 | |
| Pages: | 12 |
| | Recorded: | 11/27/2016 | | |
| Attorney Dkt #: | P 10484 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/19/2019
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Application #:
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15264655
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Filing Dt:
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09/14/2016
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Publication #:
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Pub Dt:
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03/16/2017
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Title:
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Processing Facility for Manufacturing Integrated Circuits from Semiconductor Wafers as well as Perforated Panel for a Processing Facility
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Assignee
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| LOTTERBERGSTR. 30 |
| STUTTGART, GERMANY 70499 |
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Correspondence name and address
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GUDRUN E. HUCKETT DRAUDT
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SCHUBERTSTR. 15A
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WUPPERTAL, 42289 GERMANY
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