Patent Assignment Details
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| Reel/Frame: | 040522/0984 | |
| Pages: | 7 |
| | Recorded: | 12/05/2016 | | |
| Attorney Dkt #: | 7466-1603123 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/31/2017
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Application #:
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15116280
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Filing Dt:
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12/05/2016
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Publication #:
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Pub Dt:
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03/23/2017
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Title:
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Ni Ball, Ni Core Ball, Solder Joint, Solder Paste, and Solder Foam
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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THE WEBB LAW FIRM
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420 FT. DUQUESNE BLVD., STE 1200
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ONE GATEWAY CENTER
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PITTSBURGH, PA 15222
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