Patent Assignment Details
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| Reel/Frame: | 040590/0679 | |
| Pages: | 6 |
| | Recorded: | 12/07/2016 | | |
| Attorney Dkt #: | 7466-1603046 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/27/2018
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Application #:
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15116271
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Filing Dt:
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12/07/2016
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Publication #:
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Pub Dt:
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08/31/2017
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Title:
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CU BALL, CU CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 1208555 |
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Correspondence name and address
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THE WEBB LAW FIRM, P.C.
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ONE GATEWAY CENTER
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420 FT. DUQUESNE BLVD, SUITE 1200
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PITTSBURGH, PA 15222
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