Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 040705/0566 | |
| Pages: | 8 |
| | Recorded: | 12/12/2016 | | |
| Attorney Dkt #: | THP-JEC-16018 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
15375241
|
Filing Dt:
|
12/12/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/20/2017
| | | | |
|
Title:
|
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
|
|
|
Assignee
|
|
|
|
|
| 1913-2 FUKURA |
| USUKI-SHI, OITA, JAPAN 8750053 |
|
|
Correspondence name and address
|
| |
TYPHA IP LLC
|
| |
1819 L STREET NW SUITE 200
|
| |
WASHINGTON, DC 20036
|
Search Results as of:
05/10/2024 02:25 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
