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Reel/Frame:040710/0662   Pages: 11
Recorded: 11/29/2016
Attorney Dkt #:INCEP TO MOLEX INC
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 18
1
Patent #:
6304450
Issue Dt:
10/16/2001
Application #:
09353428
Filing Dt:
07/15/1999
Title:
INTER-CIRCUIT ENCAPSULATED PACKAGING
2
Patent #:
6356448
Issue Dt:
03/12/2002
Application #:
09432878
Filing Dt:
11/02/1999
Title:
INTER-CIRCUIT ENCAPSULATED PACKAGING FOR POWER DELIVERY
3
Patent #:
6452113
Issue Dt:
09/17/2002
Application #:
09785892
Filing Dt:
02/16/2001
Publication #:
US20010032738
Pub Dt:
10/25/2001
Title:
APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT
4
Patent #:
6618268
Issue Dt:
09/09/2003
Application #:
09801437
Filing Dt:
03/08/2001
Publication #:
US20010036066
Pub Dt:
11/01/2001
Title:
METHOD AND APPARATUS FOR DELIVERING POWER TO HIGH PERFORMANCE ELECTRONIC ASSEMBLIES
5
Patent #:
6452804
Issue Dt:
09/17/2002
Application #:
09802329
Filing Dt:
03/08/2001
Publication #:
US20020057554
Pub Dt:
05/16/2002
Title:
METHOD AND APPARATUS FOR THERMAL AND MECHANICAL MANAGEMENT OF A POWER REGULATOR MODULE AND MICROPROCESSOR IN CONTACT WITH A THERMALLY CONDUCTING PLATE
6
Patent #:
6609914
Issue Dt:
08/26/2003
Application #:
09921152
Filing Dt:
08/02/2001
Publication #:
US20020016092
Pub Dt:
02/07/2002
Title:
HIGH SPEED AND DENSITY CIRCULAR CONNECTOR FOR BOARD-TO-BOARD INTERCONNECTION SYSTEMS
7
Patent #:
6490160
Issue Dt:
12/03/2002
Application #:
09921153
Filing Dt:
08/02/2001
Publication #:
US20020021556
Pub Dt:
02/21/2002
Title:
VAPOR CHAMBER WITH INTEGRATED PIN ARRAY
8
Patent #:
6741480
Issue Dt:
05/25/2004
Application #:
10005024
Filing Dt:
12/04/2001
Publication #:
US20020164895
Pub Dt:
11/07/2002
Title:
INTEGRATED POWER DELIVERY WITH FLEX CIRCUIT INTERCONNECTION FOR HIGH DENSITY HIGH POWER CIRCUITS FOR INTEGRATED CIRCUITS AND SYSTEMS
9
Patent #:
6556455
Issue Dt:
04/29/2003
Application #:
10022454
Filing Dt:
10/30/2001
Publication #:
US20020114129
Pub Dt:
08/22/2002
Title:
ULTRA-LOW IMPEDANCE POWER INTERCONNECTION SYSTEM FOR ELECTRONIC PACKAGES
10
Patent #:
6847529
Issue Dt:
01/25/2005
Application #:
10036957
Filing Dt:
12/20/2001
Publication #:
US20030002268
Pub Dt:
01/02/2003
Title:
ULTRA-LOW IMPEDANCE POWER INTERCONNECTION SYSTEM FOR ELECTRONIC PACKAGES
11
Patent #:
6623279
Issue Dt:
09/23/2003
Application #:
10132586
Filing Dt:
04/25/2002
Publication #:
US20020176229
Pub Dt:
11/28/2002
Title:
SEPARABLE POWER DELIVERY CONNECTOR
12
Patent #:
6947293
Issue Dt:
09/20/2005
Application #:
10147138
Filing Dt:
05/16/2002
Publication #:
US20020172022
Pub Dt:
11/21/2002
Title:
METHOD AND APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT
13
Patent #:
6698511
Issue Dt:
03/02/2004
Application #:
10150730
Filing Dt:
05/17/2002
Publication #:
US20020174980
Pub Dt:
11/28/2002
Title:
VORTEX HEATSINK FOR HIGH PERFORMANCE THERMAL APPLICATIONS
14
Patent #:
7245507
Issue Dt:
07/17/2007
Application #:
10201384
Filing Dt:
07/23/2002
Publication #:
US20020196614
Pub Dt:
12/26/2002
Title:
METHOD AND APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT
15
Patent #:
6754086
Issue Dt:
06/22/2004
Application #:
10245908
Filing Dt:
09/17/2002
Publication #:
US20030052655
Pub Dt:
03/20/2003
Title:
INTEGRATED MAGNETIC BUCK CONVERTER WITH MAGNETICALLY COUPLED SYNCHRONOUSLY RECTIFIED MOSFET GATE DRIVE
16
Patent #:
6801431
Issue Dt:
10/05/2004
Application #:
10290722
Filing Dt:
11/08/2002
Publication #:
US20030057548
Pub Dt:
03/27/2003
Title:
INTEGRATED POWER DELIVERY AND COOLING SYSTEM FOR HIGH POWER MICROPROCESSORS
17
Patent #:
6845013
Issue Dt:
01/18/2005
Application #:
10384057
Filing Dt:
03/04/2003
Publication #:
US20030181075
Pub Dt:
09/25/2003
Title:
RIGHT-ANGLE POWER INTERCONNECT ELECTRONIC PACKAGING ASSEMBLY
18
Patent #:
7167379
Issue Dt:
01/23/2007
Application #:
10428202
Filing Dt:
04/30/2003
Publication #:
US20030183406
Pub Dt:
10/02/2003
Title:
MICRO-SPRING INTERCONNECT SYSTEMS FOR LOW IMPEDANCE HIGH POWER APPLICATIONS
Assignor
1
INCEP TECHNOLOGIES, INC.
Exec Dt:
08/23/2004
Assignee
1
MOLEX INCORPORATED
2222 WELLINGTON COURT
LISLE, ILLINOIS 60532
Correspondence name and address
MOLEX, LLC
2222 WELLINGTON COURT
LISLE, IL 60532

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