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02/22/2000
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08455139
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05/31/1995
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10/10/2000
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08469990
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06/06/1995
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Semiconductor Chip Package Having Chip-To-Carrier
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06/15/1999
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08743776
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11/07/1996
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02/29/2000
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08747392
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11/12/1996
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Title:
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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR CONNECTING SEMICONDUCTOR REGION AND ELECTRICAL WIRING METAL VIA TITANIUM SILICIDE LAYER AND METHOD OF FABRICATION THEREOF
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10/27/1998
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08748495
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11/08/1996
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Title:
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SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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08/17/1999
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08757494
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11/27/1996
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Title:
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METHOD AND APPARATUS FOR DRAM REFRESH USING MASTER, SLAVE AND SELF- REFRESH MODES
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01/13/1998
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08757866
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11/27/1996
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Title:
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METHOD AND STRUCTURE FOR CONTROLLING INTERNAL OPERATIONS OF A DRAM ARRAY
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08/27/2002
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08762966
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12/10/1996
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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03/24/1998
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08768966
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12/18/1996
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Title:
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CHIP ON BOARD PACKAGE WITH TOP AND BOTTOM TERMINALS
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12/28/1999
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08775945
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01/03/1997
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Title:
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FLEXIBLE CONTACT POST AND POST SOCKET AND ASSOCIATED METHODS THEREFOR
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Patent #:
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10/06/1998
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08785187
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Filing Dt:
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01/17/1997
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Title:
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CHIP STACKING BY EDGE METALLIZATION
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08/04/1998
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08785611
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Filing Dt:
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01/17/1997
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Title:
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BIPOLAR TRANSISTOR HAVING AN IMPROVED EPITAXIAL BASE REGION
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05/02/2000
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08794272
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01/31/1997
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Title:
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FACE ON FACE FLIP CLIP INTEGRATION
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06/30/1998
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08802025
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02/18/1997
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Title:
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SEMICONDUCTOR DEVICE HAVING OFFSETCHIPS
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Patent #:
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03/02/1999
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08803699
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02/21/1997
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Title:
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COHERENT SIGNAL DETECTOR FOR AM-COMPATIBLE DIGITAL AUDIO BROADCAST WAVEFORM RECOVERY
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10/03/2000
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08803714
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Filing Dt:
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02/21/1997
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Title:
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RECEIVER ADDRESSABLE AM COMPATIBLE DIGITAL BROADCAST SYSTEM
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Patent #:
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03/06/2001
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08806422
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02/26/1997
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Title:
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TRANSISTOR HAVING MAIN CELL AND SUB-CELLS
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Patent #:
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03/28/2000
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08813350
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Filing Dt:
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03/07/1997
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Title:
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METHOD FOR MAKING MULTILAYER WIRING STRUCTURE
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Patent #:
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Issue Dt:
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04/07/1998
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08815245
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Filing Dt:
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03/12/1997
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Title:
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METHOD OF MANUFACTURING A HYBRID INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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10/27/1998
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Application #:
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08815253
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Filing Dt:
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03/12/1997
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Title:
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SEMICONDUCTOR BODY WITH A SUBSTRATE GLUED TO A SUPPORT BODY
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Patent #:
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Issue Dt:
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12/18/2001
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08815656
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Filing Dt:
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03/13/1997
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Title:
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PROCESS TO PRODUCE A HIGH TEMPERATURE INTERCONNECTION
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Patent #:
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Issue Dt:
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05/04/1999
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08819899
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Filing Dt:
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03/18/1997
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Title:
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BANDGAP REFERENCE CIRCUIT AND METHOD
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Patent #:
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Issue Dt:
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01/12/1999
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Application #:
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08839052
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Filing Dt:
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04/23/1997
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Title:
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REFLOW BALL GRID ARRAY ASSEMBLY
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Patent #:
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Issue Dt:
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02/09/1999
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Application #:
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08840614
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Filing Dt:
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04/21/1997
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Title:
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THIN POWER TAPE BALL GRID ARRAY PACKAGE
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Patent #:
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Issue Dt:
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06/22/1999
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Application #:
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08841642
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Filing Dt:
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04/30/1997
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Title:
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BUFFER CIRCUIT WITH WIDE GATE INPUT TRANSISTOR
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Patent #:
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Issue Dt:
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11/30/1999
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Application #:
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08845786
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Filing Dt:
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04/25/1997
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Title:
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METHOD OF MAKING CHIP MOUNTINGS AND ASSEMBLIES
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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08846941
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Filing Dt:
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04/30/1997
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Title:
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BANK ARBITRATION FOR SDRAM MEMORY CONTROL
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Patent #:
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Issue Dt:
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10/20/1998
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Application #:
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08849578
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Filing Dt:
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06/03/1997
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Title:
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ELECTRONIC PACKAGE WITH ENHANCED PAD DESIGN
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Patent #:
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Issue Dt:
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07/11/2000
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Application #:
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08862151
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Filing Dt:
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05/22/1997
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Title:
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FLEXIBLE CONNECTORS FOR MICROELECTRONIC ELEMENTS
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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08866272
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Filing Dt:
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05/30/1997
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Publication #:
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Pub Dt:
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11/29/2001
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Title:
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SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
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Patent #:
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Issue Dt:
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02/29/2000
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Application #:
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08872379
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Filing Dt:
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06/10/1997
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Title:
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BONDABLE COMPLIANT PADS FOR PACKAGING OF A SEMICONDUCTOR CHIP AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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08/28/2001
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Application #:
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08877439
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Filing Dt:
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06/17/1997
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Title:
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SOUND ENHANCEMENT SYSTEM
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Patent #:
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Issue Dt:
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09/25/2001
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Application #:
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08879922
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Filing Dt:
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06/20/1997
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Title:
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TRANSFERABLE RESILIENT ELEMENT FOR PACKAGING OF A SEMICONDUCTOR CHIP AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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12/28/1999
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Application #:
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08880784
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Filing Dt:
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06/23/1997
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Title:
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GRID ARRAY DEVICE PACKAGE INCLUDING ADVANCED HEAT TRANSFER MECHANISMS
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Patent #:
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Issue Dt:
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02/02/1999
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Application #:
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08881111
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Filing Dt:
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06/23/1997
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Title:
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SYSTEM AND METHOD FOR FORMING A GRID ARRAY DEVICE PACKAGE EMPLOYING ELECTROMAGNETIC SHIELDING
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Patent #:
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Issue Dt:
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05/09/2000
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Application #:
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08882458
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Filing Dt:
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06/25/1997
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Title:
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METHOD FOR ESTABLISHING ELECTRICAL COMMUNICATION BETWEEN A FIRST OBJECT HAVING A SOLDER BALL AND A SECOND OBJECT
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Patent #:
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Issue Dt:
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08/04/1998
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Application #:
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08883112
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Filing Dt:
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06/26/1997
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Title:
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BARE DIE MULTIPLE DIES FOR DIRECT ATTACH
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Patent #:
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Issue Dt:
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01/18/2000
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Application #:
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08915272
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Filing Dt:
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08/20/1997
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Title:
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SEMICONDUCTOR DEVICE MOUNTING STRUCTURE
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Patent #:
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Issue Dt:
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08/07/2001
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Application #:
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08918500
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Filing Dt:
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08/22/1997
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Title:
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CONDUCTIVE EPOXY FLIP-CHIP ON CHIP
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Patent #:
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Issue Dt:
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01/12/1999
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Application #:
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08927601
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Filing Dt:
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09/12/1997
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Title:
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CURVED LEAD CONFIGURATIONS
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Patent #:
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Issue Dt:
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06/22/1999
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Application #:
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08931680
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Filing Dt:
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09/16/1997
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Title:
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MULTIPLE PART COMPLIANT INTERFACE FOR PACKAGING OF A SEMICONDUCTOR CHIP AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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10/26/1999
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Application #:
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08932711
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Filing Dt:
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09/17/1997
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Title:
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INTERPOSER FOR BALL GRID ARRAY (BGA) PACKAGE
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Patent #:
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Issue Dt:
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01/11/2000
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Application #:
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08936887
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Filing Dt:
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09/25/1997
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Title:
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METHOD OF FORMING COMPLIANT MICROELECTRONIC MOUNTING DEVICE
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Patent #:
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Issue Dt:
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07/03/2001
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Application #:
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08940477
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Filing Dt:
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09/30/1997
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Title:
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ENCAPSULANT FOR MICROELECTRONIC DEVICES
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Patent #:
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Issue Dt:
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10/10/2000
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Application #:
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08943592
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Filing Dt:
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10/03/1997
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Title:
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SEMICONDUCTOR MEMORY DEVICE AND A METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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08/10/1999
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Application #:
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08947180
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Filing Dt:
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10/08/1997
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Title:
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BONDING LEAD STRUCTURE WITH ENHANCED ENCAPSULATION
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Patent #:
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Issue Dt:
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01/23/2001
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Application #:
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08947902
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Filing Dt:
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10/09/1997
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Title:
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SYSTEM AND METHOD FOR MITIGATING INTERMITTENT INTERRUPTIONS IN AN AUDIO RADIO BROADCAST SYSTEM
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Patent #:
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Issue Dt:
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11/09/1999
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Application #:
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08952019
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Filing Dt:
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02/27/1998
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Title:
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BONDING MACHINE
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Patent #:
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Issue Dt:
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08/24/1999
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Application #:
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08955441
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Filing Dt:
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10/21/1997
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Title:
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PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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12/28/1999
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Application #:
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08956682
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Filing Dt:
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10/23/1997
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Title:
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INTEGRATED CIRCUIT PACKAGE HAVING BOND FINGERS WITH ALTERNATE BONDING AREAS
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Patent #:
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Issue Dt:
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11/30/1999
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Application #:
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08961142
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Filing Dt:
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10/30/1997
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Title:
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FIELD EFFECT TRANSISTOR ARRAY INCLUDING REFRACTORY METAL SILICIDE INTERCONNECTION LAYER
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Patent #:
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Issue Dt:
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01/25/2000
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Application #:
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08962519
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Filing Dt:
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10/31/1997
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Title:
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ELECTRICALLY IMPRINTING A SEMICONDUCTOR DIE WITH IDENTIFYING INFORMATION
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Patent #:
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Issue Dt:
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03/20/2001
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Application #:
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08962693
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Filing Dt:
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11/03/1997
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Title:
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MICROELECTRONIC CONNECTIONS WITH LIQUID CONDUCTIVE ELEMENTS
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Patent #:
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Issue Dt:
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10/03/2000
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Application #:
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08962988
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Filing Dt:
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10/31/1997
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Title:
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PACKAGED MICROELECTRONIC ELEMENTS WITH ENHANCED THERMAL CONDUCTION
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Patent #:
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Issue Dt:
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11/29/2005
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Application #:
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08964457
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Filing Dt:
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11/04/1997
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Publication #:
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Pub Dt:
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04/18/2002
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Title:
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SEMICONDUCTOR INTEGRATED DEVICE AND METHOD OF FABRICATION THEROF
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Patent #:
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Issue Dt:
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10/31/2000
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Application #:
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08975403
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Filing Dt:
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11/20/1997
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Title:
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PLASMA PROCESSING METHODS AND APPARATUS
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Patent #:
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Issue Dt:
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04/04/2000
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Application #:
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08975590
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Filing Dt:
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11/20/1997
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Title:
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VACUUM DISPENSE METHOD FOR DISPENSING AN ENCAPSULANT AND MACHINE THEREFOR
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08978082
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Filing Dt:
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11/25/1997
|
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Title:
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MICROELECTRONIC COMPONENT WITH RIGID INTERPOSER
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Patent #:
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Issue Dt:
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05/09/2000
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Application #:
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08982221
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Filing Dt:
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12/01/1997
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Title:
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PROJECTING PRINTING APPARATUS, PROJECTION PRINTING METHOD, MASK PATTERN FOR ESTIMATING AMPLITUDE ABERRATIONS, METHOD OF ESTIMATING THE QUANTITY OF AMPLITUDE ABERRATION, AND AMPLITUDE-ABERRATION ESTIMATING FILTER
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Patent #:
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Issue Dt:
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11/14/2000
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Application #:
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08984814
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Filing Dt:
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12/04/1997
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Title:
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APPARATUS FOR RECORDING AND/OR READING PROGRAM HISTORY
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Patent #:
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Issue Dt:
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10/10/2000
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Application #:
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08984933
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Filing Dt:
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12/04/1997
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Title:
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A METHOD OF ENCAPSULATING A MICROELETRONIC ASSEMBLY UTILIZING A BARRIER
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Patent #:
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Issue Dt:
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07/31/2001
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Application #:
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08987283
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Filing Dt:
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12/09/1997
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Title:
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A METHOD FOR MAKING A CONNECTION COMPONENT FOR A SEMICONDUCTOR CHIP PACKAGE
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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08987570
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Filing Dt:
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12/11/1997
|
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Title:
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MICROELECTRONIC CONNECTOR WITH PLANAR ELASTOMER SOCKETS
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Patent #:
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Issue Dt:
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10/08/2002
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Application #:
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08987720
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Filing Dt:
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12/09/1997
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Title:
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METHOD OF FABRICATING SEMICONDUTOR CHIP ASSEMBLIES
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Patent #:
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Issue Dt:
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02/20/2001
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Application #:
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08988474
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Filing Dt:
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12/10/1997
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Title:
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A PROTECTIVE RESISTANCE ELEMENT FOR A SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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09/26/2000
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Application #:
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08988991
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Filing Dt:
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12/11/1997
|
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH SILICIDE LAYER WITHOUT SHORT CIRCUIT
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Patent #:
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Issue Dt:
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06/19/2001
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Application #:
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08989305
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Filing Dt:
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12/12/1997
|
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Title:
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ELECTRICAL CONNECTION WITH INWARDLY DEFORMABLE CONTACTS
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Patent #:
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Issue Dt:
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07/09/2002
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Application #:
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08989306
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Filing Dt:
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12/12/1997
|
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Title:
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COMPLIANT PACKAGE WITH CONDUCTIVE ELASTOMERIC POSTS
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Patent #:
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Issue Dt:
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11/23/1999
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Application #:
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08989312
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Filing Dt:
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12/12/1997
|
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Title:
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MICROELECTRONIC ASSEMBLY FABRICATION WITH TERMINAL FORMATION FROM A CONDUCTIVE LAYER
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Patent #:
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Issue Dt:
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11/23/1999
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Application #:
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08989368
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Filing Dt:
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12/12/1997
|
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Title:
|
PROCESS OF MANUFACTURING COMPLIANT WIREBOND PACKAGES
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Patent #:
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Issue Dt:
|
11/02/1999
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Application #:
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08989582
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Filing Dt:
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12/12/1997
|
|
Title:
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MICROELETRONIC MOUNTING WITH MULTIPLE LEAD DEFORMATION USING RESTRAINING STRAPS
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Patent #:
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Issue Dt:
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07/04/2000
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Application #:
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08989587
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Filing Dt:
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12/12/1997
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Title:
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Patent #:
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Issue Dt:
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04/25/2000
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Application #:
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08989710
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Filing Dt:
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12/12/1997
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Title:
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METHOD OF MAKING A COMPLIANT MULTICHIP PACKAGE
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Patent #:
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Issue Dt:
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12/03/2002
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Application #:
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08993094
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Filing Dt:
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12/18/1997
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Publication #:
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Pub Dt:
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11/15/2001
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Title:
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SEMICONDUCTOR DEVICE HAVING NONVOLATILE MEMORY AND METHOD OF MANUFACTURING THEREOF
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Patent #:
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Issue Dt:
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04/24/2001
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Application #:
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08996105
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Filing Dt:
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12/22/1997
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Title:
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SEMICONDUCTOR DEVICE AND FABRICATION PROCESS THEREOF
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Patent #:
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Issue Dt:
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04/27/1999
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Application #:
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08997719
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Filing Dt:
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12/23/1997
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Title:
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SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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08999758
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Filing Dt:
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11/26/1997
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Title:
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LOW PROFILE SOCKET FOR MICROELECTRONIC COMPONENTS AND METHOD FOR MAKING THE SAME
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Patent #:
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12/28/1999
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09006813
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Filing Dt:
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01/14/1998
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Title:
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INTEGRATED CIRCUIT PACKAGE HAVING SIGNAL TRACES INTERPOSED BETWEEN POWER AND GROUND CONDUCTORS IN ORDER TO FORM STRIPLINE TRANSMISSION LINES
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03/13/2001
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09010414
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01/21/1998
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Title:
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LOW COST THERMALLY ENHANCED FLIP CHIP BGA
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Patent #:
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03/13/2001
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09012019
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01/22/1998
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Title:
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11/07/2000
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09012089
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01/22/1998
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Title:
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EMPLOYING DEIONIZED WATER AND AN ABRASIVE SURFACE TO POLISH A SEMICONDUCTOR TOPOGRAPHY
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Patent #:
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04/18/2000
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Application #:
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09012590
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01/23/1998
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Title:
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UNIVERSAL UNIT STRIP/CARRIER FRAME ASSEMBLY AND METHODS
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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09017338
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Filing Dt:
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02/02/1998
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Title:
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Patent #:
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05/01/2001
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Application #:
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09019740
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Filing Dt:
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02/06/1998
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Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
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Patent #:
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05/29/2001
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09020754
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02/09/1998
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Title:
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MICROELECTRONIC LEAD STRUCTURES WITH PLURAL CONDUCTORS
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Patent #:
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06/24/2003
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09025558
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02/18/1998
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Pub Dt:
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01/03/2002
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Title:
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SEMICONDUCTOR PACKAGE HAVING LIGHT SENSITIVE CHIPS
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Patent #:
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11/21/2000
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09026494
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02/20/1998
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Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
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Patent #:
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01/30/2001
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Application #:
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09029903
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Filing Dt:
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03/12/1998
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Title:
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POLISHING METHOD AND APPARATUS
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Patent #:
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03/27/2001
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09033505
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03/02/1998
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Title:
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LAMINATE AND METHOD OF MANUFACTURE THEREOF
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Patent #:
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02/20/2001
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09034515
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03/04/1998
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Title:
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METHODS OF MAKING ANISOTROPIC CONDUCTIVE ELEMENTS FOR USE IN MICROELECTRONIC PACKAGING
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06/06/2000
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09036951
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03/09/1998
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Title:
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02/22/2000
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09037396
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03/09/1998
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METHOD AND APPARATUS FOR 1-T SCRAM COMPATIBLE MEMORY
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07/27/1999
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09040304
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03/18/1998
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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08/01/2000
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09041284
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03/11/1998
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Title:
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ARTICLE HOLDERS AND HOLDING METHODS
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11/07/2000
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09041793
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03/13/1998
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Title:
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SEMICONDUCTOR DEVICE HAVING THIN ELECTRODE LAYER ADJACENT GATE INSULATOR AND METHOD OF MANUFACTURE
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07/18/2000
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09045633
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03/19/1998
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Title:
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FORMATION OF NOVEL DRAM CELL CAPACITORS BY INTEGRATION OF CAPACITORS WITH ISOLATION TRENCH SIDEWALLS
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12/04/2001
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09047638
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03/25/1998
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Title:
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METHOD FOR FABRICATING MICROELECTRONIC ASSEMBLIES
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03/06/2001
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09047984
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03/25/1998
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FULL ADDITIVE PROCESS WITH FILLED PLATED THROUGH HOLES
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08/22/2000
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03/27/1998
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DIGITAL AUDIO BROADCASTING METHOD USING PUNCTURABLE CONVOLUTIONAL CODE
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08/06/2002
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03/27/1998
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FM IN-BAND-ON-CHANNEL DIGITAL AUDIO BROADCASTING METHOD AND SYSTEM
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