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Reel/Frame:	040797/0001			Pages:	263
		Recorded:	12/02/2016
Attorney Dkt #:	78436.00215
Conveyance:	SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 2080
Page 14 of 21
Pages: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

Patent #:	8071424	Issue Dt:	12/06/2011	Application #:	12830690	Filing Dt:	07/06/2010
Publication #:	US20100273293	Pub Dt:	10/28/2010
Title:	SUBSTRATE FOR A MICROELECTRONIC PACKAGE AND METHOD OF FABRICATING THEREOF

Patent #:	8330272	Issue Dt:	12/11/2012	Application #:	12832376	Filing Dt:	07/08/2010
Publication #:	US20120007232	Pub Dt:	01/12/2012
Title:	MICROELECTRONIC PACKAGES WITH DUAL OR MULTIPLE-ETCHED FLIP-CHIP CONNECTORS

Patent #:	8674419	Issue Dt:	03/18/2014	Application #:	12838598	Filing Dt:	07/19/2010
Publication #:	US20110012180	Pub Dt:	01/20/2011
Title:	METHOD OF FORMING A CMOS STRUCTURE HAVING GATE INSULATION FILMS OF DIFFERENT THICKNESSES

Patent #:	8482111	Issue Dt:	07/09/2013	Application #:	12838974	Filing Dt:	07/19/2010
Publication #:	US20120013000	Pub Dt:	01/19/2012
Title:	STACKABLE MOLDED MICROELECTRONIC PACKAGES

Patent #:	9159708	Issue Dt:	10/13/2015	Application #:	12839038	Filing Dt:	07/19/2010
Publication #:	US20120013001	Pub Dt:	01/19/2012
Title:	STACKABLE MOLDED MICROELECTRONIC PACKAGES WITH AREA ARRAY UNIT CONNECTORS

Patent #:	8847376	Issue Dt:	09/30/2014	Application #:	12842587	Filing Dt:	07/23/2010
Publication #:	US20120020026	Pub Dt:	01/26/2012
Title:	MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

Patent #:	9640437	Issue Dt:	05/02/2017	Application #:	12842612	Filing Dt:	07/23/2010
Publication #:	US20120018893	Pub Dt:	01/26/2012
Title:	METHODS OF FORMING SEMICONDUCTOR ELEMENTS USING MICRO-ABRASIVE PARTICLE STREAM

Patent #:	8796135	Issue Dt:	08/05/2014	Application #:	12842651	Filing Dt:	07/23/2010
Publication #:	US20120018863	Pub Dt:	01/26/2012
Title:	MICROELECTRONIC ELEMENTS WITH REAR CONTACTS CONNECTED WITH VIA FIRST OR VIA MIDDLE STRUCTURES

Patent #:	8697569	Issue Dt:	04/15/2014	Application #:	12842669	Filing Dt:	07/23/2010
Publication #:	US20120018894	Pub Dt:	01/26/2012
Title:	NON-LITHOGRAPHIC FORMATION OF THREE-DIMENSIONAL CONDUCTIVE ELEMENTS

Patent #:	8598695	Issue Dt:	12/03/2013	Application #:	12842692	Filing Dt:	07/23/2010
Publication #:	US20120018895	Pub Dt:	01/26/2012
Title:	ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELEMENT EMBEDDED THEREIN

Patent #:	8791575	Issue Dt:	07/29/2014	Application #:	12842717	Filing Dt:	07/23/2010
Publication #:	US20120018868	Pub Dt:	01/26/2012
Title:	MICROELECTRONIC ELEMENTS HAVING METALLIC PADS OVERLYING VIAS

Patent #:	8580607	Issue Dt:	11/12/2013	Application #:	12844463	Filing Dt:	07/27/2010
Publication #:	US20120025365	Pub Dt:	02/02/2012
Title:	MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING

Patent #:	8238739	Issue Dt:	08/07/2012	Application #:	12848804	Filing Dt:	08/02/2010
Title:	STAGE WITH BUILT-IN DAMPING

Patent #:	8090252	Issue Dt:	01/03/2012	Application #:	12848834	Filing Dt:	08/02/2010
Title:	LENS BARREL ASSEMBLY FOR A CAMERA

Patent #:	7910922	Issue Dt:	03/22/2011	Application #:	12854654	Filing Dt:	08/11/2010
Publication #:	US20100301334	Pub Dt:	12/02/2010
Title:	SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURE THEREOF

Patent #:	8396575	Issue Dt:	03/12/2013	Application #:	12856442	Filing Dt:	08/13/2010
Publication #:	US20110040395	Pub Dt:	02/17/2011
Title:	OBJECT-ORIENTED AUDIO STREAMING SYSTEM

Patent #:	8396576	Issue Dt:	03/12/2013	Application #:	12856449	Filing Dt:	08/13/2010
Publication #:	US20110040396	Pub Dt:	02/17/2011
Title:	SYSTEM FOR ADAPTIVELY STREAMING AUDIO OBJECTS

Patent #:	8396577	Issue Dt:	03/12/2013	Application #:	12856450	Filing Dt:	08/13/2010
Publication #:	US20110040397	Pub Dt:	02/17/2011
Title:	SYSTEM FOR CREATING AUDIO OBJECTS FOR STREAMING

Patent #:	8704347	Issue Dt:	04/22/2014	Application #:	12857054	Filing Dt:	08/16/2010
Publication #:	US20110012259	Pub Dt:	01/20/2011
Title:	PACKAGED SEMICONDUCTOR CHIPS

Patent #:	8110911	Issue Dt:	02/07/2012	Application #:	12864125	Filing Dt:	07/22/2010
Publication #:	US20100295178	Pub Dt:	11/25/2010
Title:	SEMICONDUCTOR CHIP PACKAGE WITH POST ELECTRODES

Patent #:	8208299	Issue Dt:	06/26/2012	Application #:	12869378	Filing Dt:	08/26/2010
Publication #:	US20100322001	Pub Dt:	12/23/2010
Title:	INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE PROGRAMMABLE MEMORY HAVING VARIABLE COUPLING AND SEPARATE READ/WRITE PATHS

Patent #:	7920426	Issue Dt:	04/05/2011	Application #:	12869469	Filing Dt:	08/26/2010
Publication #:	US20100322010	Pub Dt:	12/23/2010
Title:	NON-VOLATILE MEMORY PROGRAMMABLE THROUGH AREAL CAPACITIVE COUPLING

Patent #:	8014662	Issue Dt:	09/06/2011	Application #:	12873943	Filing Dt:	09/01/2010
Title:	AUTOFOCUS CAMERA SYSTEMS AND METHODS

Patent #:	8391700	Issue Dt:	03/05/2013	Application #:	12873962	Filing Dt:	09/01/2010
Title:	AUTOFOCUS CAMERA SYSTEMS AND METHODS

Patent #:	8685793	Issue Dt:	04/01/2014	Application #:	12883421	Filing Dt:	09/16/2010
Publication #:	US20120068351	Pub Dt:	03/22/2012
Title:	CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING

Patent #:	8686565	Issue Dt:	04/01/2014	Application #:	12883431	Filing Dt:	09/16/2010
Publication #:	US20120068352	Pub Dt:	03/22/2012
Title:	STACKED CHIP ASSEMBLY HAVING VERTICAL VIAS

Patent #:	8581377	Issue Dt:	11/12/2013	Application #:	12883556	Filing Dt:	09/16/2010
Publication #:	US20120068317	Pub Dt:	03/22/2012
Title:	TSOP WITH IMPEDANCE CONTROL

Patent #:	8853708	Issue Dt:	10/07/2014	Application #:	12883612	Filing Dt:	09/16/2010
Publication #:	US20120068361	Pub Dt:	03/22/2012
Title:	STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL

Patent #:	8222725	Issue Dt:	07/17/2012	Application #:	12883811	Filing Dt:	09/16/2010
Publication #:	US20120068365	Pub Dt:	03/22/2012
Title:	METAL CAN IMPEDANCE CONTROL STRUCTURE

Patent #:	8786083	Issue Dt:	07/22/2014	Application #:	12883821	Filing Dt:	09/16/2010
Publication #:	US20120068338	Pub Dt:	03/22/2012
Title:	IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL

Patent #:	8847380	Issue Dt:	09/30/2014	Application #:	12884649	Filing Dt:	09/17/2010
Publication #:	US20120068330	Pub Dt:	03/22/2012
Title:	STAGED VIA FORMATION FROM BOTH SIDES OF CHIP

Patent #:	8610259	Issue Dt:	12/17/2013	Application #:	12884695	Filing Dt:	09/17/2010
Publication #:	US20120068327	Pub Dt:	03/22/2012
Title:	MULTI-FUNCTION AND SHIELDED 3D INTERCONNECTS

Patent #:	8072057	Issue Dt:	12/06/2011	Application #:	12890058	Filing Dt:	09/24/2010
Publication #:	US20110012250	Pub Dt:	01/20/2011
Title:	SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION

Patent #:	8159053	Issue Dt:	04/17/2012	Application #:	12892739	Filing Dt:	09/28/2010
Publication #:	US20110012246	Pub Dt:	01/20/2011
Title:	FLAT LEADLESS PACKAGES AND STACKED LEADLESS PACKAGE ASSEMBLIES

Patent #:	8879750	Issue Dt:	11/04/2014	Application #:	12901330	Filing Dt:	10/08/2010
Publication #:	US20110085677	Pub Dt:	04/14/2011
Title:	ADAPTIVE DYNAMIC RANGE ENHANCEMENT OF AUDIO RECORDINGS

Patent #:	7972070	Issue Dt:	07/05/2011	Application #:	12901440	Filing Dt:	10/08/2010
Title:	IMPULSE ACTUATED MEMS DEVICES

Patent #:	8553420	Issue Dt:	10/08/2013	Application #:	12907522	Filing Dt:	10/19/2010
Publication #:	US20120092832	Pub Dt:	04/19/2012
Title:	ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS

Patent #:	8431435	Issue Dt:	04/30/2013	Application #:	12908227	Filing Dt:	10/20/2010
Publication #:	US20110033979	Pub Dt:	02/10/2011
Title:	EDGE CONNECT WAFER LEVEL STACKING

Patent #:	8022527	Issue Dt:	09/20/2011	Application #:	12908265	Filing Dt:	10/20/2010
Publication #:	US20110031629	Pub Dt:	02/10/2011
Title:	EDGE CONNECT WAFER LEVEL STACKING

Patent #:	8524533	Issue Dt:	09/03/2013	Application #:	12913385	Filing Dt:	10/27/2010
Publication #:	US20110041329	Pub Dt:	02/24/2011
Title:	ROOM TEMPERATURE METAL DIRECT BONDING

Patent #:	9147583	Issue Dt:	09/29/2015	Application #:	12913529	Filing Dt:	10/27/2010
Publication #:	US20110266684	Pub Dt:	11/03/2011
Title:	Selective Die Electrical Insulation By Additive Process

Patent #:	8629543	Issue Dt:	01/14/2014	Application #:	12913604	Filing Dt:	10/27/2010
Publication #:	US20110037159	Pub Dt:	02/17/2011
Title:	ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES

Patent #:	8451868	Issue Dt:	05/28/2013	Application #:	12923780	Filing Dt:	10/07/2010
Publication #:	US20110090897	Pub Dt:	04/21/2011
Title:	SYSTEMS AND METHODS FOR TRANSMITTING MEDIA CONTENT VIA DIGITAL RADIO BROADCAST TRANSMISSION FOR SYNCHRONIZED RENDERING BY A RECEIVER

Patent #:	8399980	Issue Dt:	03/19/2013	Application #:	12935341	Filing Dt:	09/29/2010
Publication #:	US20110012269	Pub Dt:	01/20/2011
Title:	ELECTRONIC COMPONENT USED FOR WIRING AND METHOD FOR MANUFACTURING THE SAME

Patent #:	8697492	Issue Dt:	04/15/2014	Application #:	12938068	Filing Dt:	11/02/2010
Publication #:	US20120104595	Pub Dt:	05/03/2012
Title:	FLOW UNDERFILL FOR MICROELECTRONIC PACKAGE

Patent #:	8531020	Issue Dt:	09/10/2013	Application #:	12938094	Filing Dt:	11/02/2010
Publication #:	US20110042810	Pub Dt:	02/24/2011
Title:	STACKED PACKAGING IMPROVEMENTS

Patent #:	8912661	Issue Dt:	12/16/2014	Application #:	12939524	Filing Dt:	11/04/2010
Publication #:	US20110272825	Pub Dt:	11/10/2011
Title:	STACKED DIE ASSEMBLY HAVING REDUCED STRESS ELECTRICAL INTERCONNECTS

Patent #:	8624342	Issue Dt:	01/07/2014	Application #:	12940326	Filing Dt:	11/05/2010
Publication #:	US20120112301	Pub Dt:	05/10/2012
Title:	REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS

Patent #:	8076788	Issue Dt:	12/13/2011	Application #:	12941392	Filing Dt:	11/08/2010
Publication #:	US20110049696	Pub Dt:	03/03/2011
Title:	OFF-CHIP VIAS IN STACKED CHIPS

Patent #:	8736064	Issue Dt:	05/27/2014	Application #:	12941511	Filing Dt:	11/08/2010
Publication #:	US20110057324	Pub Dt:	03/10/2011
Title:	STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT HAVING METAL TRACES EMBEDDED IN SURFACE OF DIELECTRIC

Patent #:	8547627	Issue Dt:	10/01/2013	Application #:	12946396	Filing Dt:	11/15/2010
Publication #:	US20120119611	Pub Dt:	05/17/2012
Title:	ELECTRICAL ROUTING

Patent #:	9352962	Issue Dt:	05/31/2016	Application #:	12946430	Filing Dt:	11/15/2010
Publication #:	US20120119324	Pub Dt:	05/17/2012
Title:	MEMS ISOLATION STRUCTURES

Patent #:	8605375	Issue Dt:	12/10/2013	Application #:	12946466	Filing Dt:	11/15/2010
Publication #:	US20120120507	Pub Dt:	05/17/2012
Title:	MOUNTING FLEXURE CONTACTS

Patent #:	8884381	Issue Dt:	11/11/2014	Application #:	12946495	Filing Dt:	11/15/2010
Publication #:	US20120119325	Pub Dt:	05/17/2012
Title:	GUARD TRENCH

Patent #:	8619378	Issue Dt:	12/31/2013	Application #:	12946515	Filing Dt:	11/15/2010
Publication #:	US20120120508	Pub Dt:	05/17/2012
Title:	ROTATIONAL COMB DRIVE Z-STAGE

Patent #:	8604663	Issue Dt:	12/10/2013	Application #:	12946526	Filing Dt:	11/15/2010
Publication #:	US20120119612	Pub Dt:	05/17/2012
Title:	MOTION CONTROLLED ACTUATOR

Patent #:	9052567	Issue Dt:	06/09/2015	Application #:	12946543	Filing Dt:	11/15/2010
Publication #:	US20120120297	Pub Dt:	05/17/2012
Title:	ACTUATOR INSIDE OF MOTION CONTROL

Patent #:	8337103	Issue Dt:	12/25/2012	Application #:	12946557	Filing Dt:	11/15/2010
Publication #:	US20120121247	Pub Dt:	05/17/2012
Title:	LONG HINGE ACTUATOR SNUBBING

Patent #:	8637961	Issue Dt:	01/28/2014	Application #:	12946614	Filing Dt:	11/15/2010
Publication #:	US20120119613	Pub Dt:	05/17/2012
Title:	MEMS ACTUATOR DEVICE

Patent #:	9061883	Issue Dt:	06/23/2015	Application #:	12946624	Filing Dt:	11/15/2010
Publication #:	US20120119425	Pub Dt:	05/17/2012
Title:	ACTUATOR MOTION CONTROL FEATURES

Patent #:	8430580	Issue Dt:	04/30/2013	Application #:	12946646	Filing Dt:	11/15/2010
Publication #:	US20120120262	Pub Dt:	05/17/2012
Title:	ROTATIONALLY DEPLOYED ACTUATORS

Patent #:	8608393	Issue Dt:	12/17/2013	Application #:	12946657	Filing Dt:	11/15/2010
Publication #:	US20120120308	Pub Dt:	05/17/2012
Title:	CAPILLARY ACTUATOR DEPLOYMENT

Patent #:	8803256	Issue Dt:	08/12/2014	Application #:	12946670	Filing Dt:	11/15/2010
Publication #:	US20120119614	Pub Dt:	05/17/2012
Title:	LINEARLY DEPLOYED ACTUATORS

Patent #:	8358925	Issue Dt:	01/22/2013	Application #:	12946680	Filing Dt:	11/15/2010
Publication #:	US20120121242	Pub Dt:	05/17/2012
Title:	LENS BARREL WITH MEMS ACTUATORS

Patent #:	8378478	Issue Dt:	02/19/2013	Application #:	12953994	Filing Dt:	11/24/2010
Publication #:	US20120126389	Pub Dt:	05/24/2012
Title:	ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND VIAS CONNECTED TO THE CENTRAL CONTACTS

Patent #:	8420549	Issue Dt:	04/16/2013	Application #:	12954207	Filing Dt:	11/24/2010
Publication #:	US20110130010	Pub Dt:	06/02/2011
Title:	ETCHING AND CLEANING METHODS AND ETCHING AND CLEANING APPARATUSES USED THEREFOR

Patent #:	8163373	Issue Dt:	04/24/2012	Application #:	12954735	Filing Dt:	11/26/2010
Publication #:	US20110143150	Pub Dt:	06/16/2011
Title:	METHOD OF ROOM TEMPERATURE COVALENT BONDING

Patent #:	8153505	Issue Dt:	04/10/2012	Application #:	12954740	Filing Dt:	11/26/2010
Publication #:	US20110067803	Pub Dt:	03/24/2011
Title:	METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Patent #:	8637968	Issue Dt:	01/28/2014	Application #:	12958866	Filing Dt:	12/02/2010
Publication #:	US20120139094	Pub Dt:	06/07/2012
Title:	STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIVE CHIPS

Patent #:	8610264	Issue Dt:	12/17/2013	Application #:	12962806	Filing Dt:	12/08/2010
Publication #:	US20120146210	Pub Dt:	06/14/2012
Title:	COMPLIANT INTERCONNECTS IN WAFERS

Patent #:	8432045	Issue Dt:	04/30/2013	Application #:	12963938	Filing Dt:	12/09/2010
Publication #:	US20120119367	Pub Dt:	05/17/2012
Title:	CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES

Patent #:	8502340	Issue Dt:	08/06/2013	Application #:	12964049	Filing Dt:	12/09/2010
Publication #:	US20120146182	Pub Dt:	06/14/2012
Title:	HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS

Patent #:	8884448	Issue Dt:	11/11/2014	Application #:	12965172	Filing Dt:	12/10/2010
Publication #:	US20110074027	Pub Dt:	03/31/2011
Title:	FLIP CHIP INTERCONNECTION WITH DOUBLE POST

Patent #:	8853558	Issue Dt:	10/07/2014	Application #:	12965192	Filing Dt:	12/10/2010
Publication #:	US20120145442	Pub Dt:	06/14/2012
Title:	INTERCONNECT STRUCTURE

Patent #:	8652935	Issue Dt:	02/18/2014	Application #:	12970529	Filing Dt:	12/16/2010
Publication #:	US20120153426	Pub Dt:	06/21/2012
Title:	VOID-FREE WAFER BONDING USING CHANNELS

Patent #:	8512491	Issue Dt:	08/20/2013	Application #:	12974611	Filing Dt:	12/21/2010
Publication #:	US20120152433	Pub Dt:	06/21/2012
Title:	DUAL WAFER SPIN COATING

Patent #:	8338925	Issue Dt:	12/25/2012	Application #:	12974744	Filing Dt:	12/21/2010
Publication #:	US20110095441	Pub Dt:	04/28/2011
Title:	MICROELECTRONIC ASSEMBLIES HAVING COMPLIANT LAYERS

Patent #:	7977208	Issue Dt:	07/12/2011	Application #:	12982346	Filing Dt:	12/30/2010
Publication #:	US20110097845	Pub Dt:	04/28/2011
Title:	METHOD AND APPARATUS FOR PACKAGING CIRCUIT DEVICES

Patent #:	8884403	Issue Dt:	11/11/2014	Application #:	12982376	Filing Dt:	12/30/2010
Publication #:	US20110101505	Pub Dt:	05/05/2011
Title:	Semiconductor Die Array Structure

Patent #:	8575766	Issue Dt:	11/05/2013	Application #:	12986556	Filing Dt:	01/07/2011
Publication #:	US20110095408	Pub Dt:	04/28/2011
Title:	MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT

Patent #:	8269357	Issue Dt:	09/18/2012	Application #:	12986601	Filing Dt:	01/07/2011
Publication #:	US20110101535	Pub Dt:	05/05/2011
Title:	MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT

Patent #:	8557700	Issue Dt:	10/15/2013	Application #:	12991143	Filing Dt:	11/05/2010
Publication #:	US20110057325	Pub Dt:	03/10/2011
Title:	METHOD FOR MANUFACTURING A CHIP-SIZE DOUBLE SIDE CONNECTION PACKAGE

Patent #:	8269335	Issue Dt:	09/18/2012	Application #:	13008579	Filing Dt:	01/18/2011
Publication #:	US20110115081	Pub Dt:	05/19/2011
Title:	MULTILAYER SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT

Patent #:	8325519	Issue Dt:	12/04/2012	Application #:	13011606	Filing Dt:	01/21/2011
Publication #:	US20110116314	Pub Dt:	05/19/2011
Title:	METHOD OF OPERATING INTEGRATED CIRCUIT EMBEDDED WITH NON-VOLATILE PROGRAMMABLE MEMORY HAVING VARIABLE COUPLING RELATED APPLICATION DATA

Patent #:	8798196	Issue Dt:	08/05/2014	Application #:	13012847	Filing Dt:	01/25/2011
Publication #:	US20120189070	Pub Dt:	07/26/2012
Title:	PEAK-TO-AVERAGE POWER RATIO REDUCTION FOR HYBRID FM HD RADIO TRANSMISSION

Patent #:	8728865	Issue Dt:	05/20/2014	Application #:	13012949	Filing Dt:	01/25/2011
Publication #:	US20110165733	Pub Dt:	07/07/2011
Title:	MICROELECTRONIC PACKAGES AND METHODS THEREFOR

Patent #:	8908874	Issue Dt:	12/09/2014	Application #:	13021922	Filing Dt:	02/07/2011
Publication #:	US20120057715	Pub Dt:	03/08/2012
Title:	SPATIAL AUDIO ENCODING AND REPRODUCTION

Patent #:	8255276	Issue Dt:	08/28/2012	Application #:	13022068	Filing Dt:	02/07/2011
Title:	SYSTEM AND METHOD FOR GENERATING MULTIMEDIA ACCOMPANIMENTS TO BROADCAST DATA

Patent #:	8629481	Issue Dt:	01/14/2014	Application #:	13032009	Filing Dt:	02/22/2011
Publication #:	US20110140185	Pub Dt:	06/16/2011
Title:	SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Patent #:	8324081	Issue Dt:	12/04/2012	Application #:	13041192	Filing Dt:	03/04/2011
Publication #:	US20110147943	Pub Dt:	06/23/2011
Title:	WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS

Patent #:	9018094	Issue Dt:	04/28/2015	Application #:	13042186	Filing Dt:	03/07/2011
Publication #:	US20120228778	Pub Dt:	09/13/2012
Title:	SUBSTRATES WITH THROUGH VIAS WITH CONDUCTIVE FEATURES FOR CONNECTION TO INTEGRATED CIRCUIT ELEMENTS, AND METHODS FOR FORMING THROUGH VIAS IN SUBSTRATES

Patent #:	8283207	Issue Dt:	10/09/2012	Application #:	13043094	Filing Dt:	03/08/2011
Publication #:	US20110156266	Pub Dt:	06/30/2011
Title:	METHODS FOR FORMING THROUGH-SUBSTRATE CONDUCTOR FILLED VIAS, AND ELECTRONIC ASSEMBLIES FORMED USING SUCH METHODS

Patent #:	9337791	Issue Dt:	05/10/2016	Application #:	13048428	Filing Dt:	03/15/2011
Title:	SYSTEM AND METHOD FOR GENERATING MULTIMEDIA ACCOMPANIMENTS TO BROADCAST DATA

Patent #:	8255277	Issue Dt:	08/28/2012	Application #:	13048493	Filing Dt:	03/15/2011
Title:	SYSTEM AND METHOD FOR GENERATING MULTIMEDIA ACCOMPANIMENTS TO BROADCAST DATA

Patent #:	8283775	Issue Dt:	10/09/2012	Application #:	13049307	Filing Dt:	03/16/2011
Publication #:	US20110163436	Pub Dt:	07/07/2011
Title:	WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Patent #:	8587126	Issue Dt:	11/19/2013	Application #:	13051414	Filing Dt:	03/18/2011
Publication #:	US20120139124	Pub Dt:	06/07/2012
Title:	STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PLURAL ACTIVE CHIPS

Patent #:	8736066	Issue Dt:	05/27/2014	Application #:	13051424	Filing Dt:	03/18/2011
Publication #:	US20120139082	Pub Dt:	06/07/2012
Title:	STACKED MICROELECTRONIC ASSEMBY WITH TSVS FORMED IN STAGES AND CARRIER ABOVE CHIP

Patent #:	9386162	Issue Dt:	07/05/2016	Application #:	13053088	Filing Dt:	03/21/2011
Publication #:	US20110172997	Pub Dt:	07/14/2011
Title:	SYSTEMS AND METHODS FOR REDUCING AUDIO NOISE

Patent #:	8405221	Issue Dt:	03/26/2013	Application #:	13067660	Filing Dt:	06/17/2011
Publication #:	US20120025391	Pub Dt:	02/02/2012
Title:	SEMICONDUCTOR DEVICE AND MULTILAYER SEMICONDUCTOR DEVICE

100

Patent #:	8486758	Issue Dt:	07/16/2013	Application #:	13076969	Filing Dt:	03/31/2011
Publication #:	US20120153488	Pub Dt:	06/21/2012
Title:	SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING