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14148096
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Filing Dt:
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01/06/2014
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Pub Dt:
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05/01/2014
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Title:
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04/19/2016
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14151149
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01/09/2014
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10/16/2014
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Title:
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WEARABLE ULTRA-THIN MINIATURIZED MOBILE COMMUNICATIONS
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03/08/2016
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14156967
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01/16/2014
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05/15/2014
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Title:
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STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR
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02/28/2017
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14157790
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01/17/2014
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07/23/2015
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Title:
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FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE FOR TESTING
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08/18/2015
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14160129
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01/21/2014
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05/15/2014
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Title:
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DIELECTRIC TRENCHES, NICKEL/TANTALUM OXIDE STRUCTURES, AND CHEMICAL MECHANICAL POLISHING TECHNIQUES
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09/16/2014
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14162011
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01/23/2014
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05/15/2014
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Title:
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02/10/2015
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14163145
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01/24/2014
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05/22/2014
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Title:
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METHODS OF FABRICATING A FLIP CHIP PACKAGE FOR DRAM WITH TWO UNDERFILL MATERIALS
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NONE
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14168386
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01/30/2014
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05/29/2014
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Title:
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FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF
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08/18/2015
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14176328
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02/10/2014
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09/11/2014
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Title:
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METHOD OF FORMING A CMOS STRUCTURE HAVING GATE INSULATION FILMS OF DIFFERENT THICKNESSES
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02/17/2015
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14176344
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02/10/2014
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06/19/2014
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Title:
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MICROELECTRONIC PACKAGE WITH TERMINALS ON DIELECTRIC MASS
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06/30/2015
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14177527
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02/11/2014
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06/05/2014
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Title:
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PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
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01/26/2016
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14181466
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02/14/2014
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06/12/2014
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Title:
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RELIABLE WIRE METHOD
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03/15/2016
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14186380
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02/21/2014
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06/19/2014
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Title:
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STUB MINIMIZATION USING DUPLICATE SETS OF TERMINALS HAVING MODULO-X SYMMETRY FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS
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03/08/2016
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14187627
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02/24/2014
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06/19/2014
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Title:
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STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS HAVING MODULO-X SYMMETRY IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE
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07/14/2015
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14197070
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03/04/2014
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07/24/2014
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Title:
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METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
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10/27/2015
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14198723
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03/06/2014
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07/03/2014
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3D IC METHOD AND DEVICE
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03/10/2015
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14199156
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03/06/2014
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07/03/2014
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Title:
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DRAM SECURITY ERASE
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12/29/2015
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14199169
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03/06/2014
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07/03/2014
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Title:
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STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS
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Patent #:
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09/01/2015
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14199181
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03/06/2014
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07/31/2014
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Title:
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SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STRUCTURES
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02/07/2017
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14199706
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03/06/2014
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09/10/2015
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Title:
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POST-ENCODING BITRATE REDUCTION OF MULTIPLE OBJECT AUDIO
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03/29/2016
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14201473
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03/07/2014
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09/10/2015
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Title:
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Thermal Vias Disposed in a Substrate Without a Liner Layer
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06/14/2016
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14201585
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03/07/2014
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Pub Dt:
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09/10/2015
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THERMAL VIAS DISPOSED IN A SUBSTRATE PROXIMATE TO A WELL THEREOF
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10/17/2017
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14201655
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03/07/2014
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09/18/2014
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SYSTEM AND METHODS FOR PROCESSING STEREO AUDIO CONTENT
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03/22/2016
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14201702
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03/07/2014
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07/03/2014
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AUTOFOCUS CAMERA SYSTEMS AND METHODS
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04/07/2015
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14204860
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03/11/2014
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08/07/2014
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Title:
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REDUCED STRESS TSV AND INTERPOSER STRUCTURES
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02/28/2017
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14206756
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03/12/2014
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09/17/2015
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VIA STRUCTURE FOR SIGNAL EQUALIZATION
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05/02/2017
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14206868
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03/12/2014
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09/18/2014
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Title:
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AUTOMATIC MULTI-CHANNEL MUSIC MIX FROM MULTIPLE AUDIO STEMS
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NONE
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14214365
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03/14/2014
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Pub Dt:
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09/17/2015
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Title:
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INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METHODS OF MANUFACTURE
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03/17/2015
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14217820
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03/18/2014
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07/17/2014
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Title:
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STACKABLE MICROELECTRONIC PACKAGE STRUCTURES
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08/30/2016
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14219398
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03/19/2014
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07/24/2014
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Title:
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LOW-STRESS TSV DESIGN USING CONDUCTIVE PARTICLES
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08/16/2016
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14220912
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03/20/2014
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09/24/2015
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Title:
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STACKED DIE INTEGRATED CIRCUIT
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08/02/2016
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14221486
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03/21/2014
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07/24/2014
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INTERPOSER HAVING MOLDED LOW CTE DIELECTRIC
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02/23/2016
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14224379
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03/25/2014
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Pub Dt:
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07/24/2014
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Title:
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STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES AND CARRIER ABOVE CHIP
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12/15/2015
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14230388
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03/31/2014
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Pub Dt:
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10/01/2015
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Title:
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BATCH PROCESS FABRICATION OF PACKAGE-ON-PACKAGE MICROELECTRONIC ASSEMBLIES
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11/11/2014
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14230521
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03/31/2014
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Title:
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FABRICATION OF MICROELECTRONIC ASSEMBLIES HAVING STACK TERMINALS COUPLED BY CONNECTORS EXTENDING THROUGH ENCAPSULATION
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02/02/2016
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14242206
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04/01/2014
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Pub Dt:
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07/31/2014
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Title:
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SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
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12/22/2015
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14242279
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04/01/2014
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Pub Dt:
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07/31/2014
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Title:
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MICROELECTRONIC PACKAGES AND METHODS THEREFOR
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04/28/2015
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14243484
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04/02/2014
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Pub Dt:
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07/31/2014
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Title:
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NON-LITHOGRAPHIC FORMATION OF THREE-DIMENSIONAL CONDUCTIVE ELEMENTS
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Issue Dt:
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10/20/2015
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14243994
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04/03/2014
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Pub Dt:
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07/31/2014
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Title:
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MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC UNITS AND METHOD FOR MANUFACTURE THEREOF
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06/28/2016
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14244007
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04/03/2014
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Pub Dt:
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11/06/2014
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Title:
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MICROELECTRONIC ASSEMBLY INCLUDING MEMORY PACKAGES CONNECTED TO CIRCUIT PANEL, THE MEMORY PACKAGES HAVING STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS
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03/17/2015
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14244060
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04/03/2014
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Pub Dt:
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11/06/2014
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Title:
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STUB MINIMIZATION FOR MULTI-DIE WIREBOND ASSEMBLIES WITH PARALLEL WINDOWS
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10/13/2015
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14245773
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04/04/2014
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Pub Dt:
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11/13/2014
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Title:
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POWER BOOSTING CIRCUIT FOR SEMICONDUCTOR PACKAGING
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04/04/2017
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14245882
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04/04/2014
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10/09/2014
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Title:
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LAYERED AUDIO RECONSTRUCTION SYSTEM
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01/31/2017
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14245903
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04/04/2014
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10/09/2014
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Title:
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LAYERED AUDIO CODING AND TRANSMISSION
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Issue Dt:
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06/28/2016
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14250317
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04/10/2014
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05/28/2015
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Title:
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DIE STACKS WITH ONE OR MORE BOND VIA ARRAYS OF WIRE BOND WIRES AND WITH ONE OR MORE ARRAYS OF BUMP INTERCONNECTS
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