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06/14/2016
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14597534
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01/15/2015
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05/07/2015
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Title:
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12/12/2017
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14600595
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01/20/2015
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05/14/2015
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Title:
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02/14/2017
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14602984
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01/22/2015
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07/28/2016
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Title:
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04/12/2016
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14605208
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01/26/2015
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05/28/2015
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Title:
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ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS
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10/04/2016
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14605550
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01/26/2015
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05/14/2015
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Title:
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08/09/2016
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14605654
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01/26/2015
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05/21/2015
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Title:
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VIA IN SUBSTRATE WITH DEPOSITED LAYER
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05/03/2016
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14609720
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01/30/2015
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Title:
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Localized sealing of interconnect structures in small gaps
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05/10/2016
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14609878
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01/30/2015
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Title:
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CONTACT ARRANGEMENTS FOR STACKABLE MICROELECTRONIC PACKAGE STRUCTURES
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05/24/2016
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14609896
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01/30/2015
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Title:
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09/27/2016
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14610300
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01/30/2015
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05/21/2015
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Title:
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VIAS IN POROUS SUBSTRATES
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06/28/2016
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14612882
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02/03/2015
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Title:
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System And Method For Increasing Throughput in Digital Radio Broadcast Receiver
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04/12/2016
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14617236
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02/09/2015
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06/04/2015
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Title:
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MULTIPLE DIE STACKING FOR TWO OR MORE DIE
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10/03/2017
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14620544
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02/12/2015
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09/24/2015
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Title:
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RESIDUAL ENCODING IN AN OBJECT-BASED AUDIO SYSTEM
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03/14/2017
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14622260
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02/13/2015
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08/18/2016
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Title:
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Method and Apparatus for Analog and Digital Audio Blend for HD Radio Receivers
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11/01/2016
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14623161
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02/16/2015
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08/20/2015
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Title:
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MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES
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06/28/2016
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14627252
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02/20/2015
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06/11/2015
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Title:
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METAL PVD-FREE CONDUCTING STRUCTURES
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06/07/2016
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14628645
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02/23/2015
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06/11/2015
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Title:
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TUNABLE COMPOSITE INTERPOSER
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11/29/2016
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14628894
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02/23/2015
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06/18/2015
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Title:
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LOW COST HYBRID HIGH DENSITY PACKAGE
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11/22/2016
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14629271
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02/23/2015
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Pub Dt:
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08/25/2016
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Title:
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MICROELECTRONIC ASSEMBLIES FORMED USING METAL SILICIDE, AND METHODS OF FABRICATION
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11/22/2016
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14629271
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02/23/2015
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Publication #:
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Pub Dt:
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08/25/2016
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Title:
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MICROELECTRONIC ASSEMBLIES FORMED USING METAL SILICIDE, AND METHODS OF FABRICATION
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Patent #:
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02/28/2017
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14629487
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02/23/2015
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Pub Dt:
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06/18/2015
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Title:
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QUANTUM EFFICIENCY OF MULTIPLE QUANTUM WELLS
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08/28/2018
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14632997
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02/26/2015
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08/27/2015
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Title:
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OBJECT-BASED AUDIO LOUDNESS MANAGEMENT
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07/19/2016
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14633746
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02/27/2015
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Title:
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MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSIONS OF CONDUCTIVE VIAS PROTRUDING FROM THROUGH-HOLES PASSING THROUGH SUBSTRATES
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02/06/2018
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14639789
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03/05/2015
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09/08/2016
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Title:
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PRESSING OF WIRE BOND WIRE TIPS TO PROVIDE BENT-OVER TIPS
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04/24/2018
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14639942
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03/05/2015
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Pub Dt:
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09/08/2016
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Title:
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EMBEDDED GRAPHITE HEAT SPREADER FOR 3DIC
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03/29/2016
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14642588
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03/09/2015
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10/08/2015
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Title:
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DRAM SECURITY ERASE
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05/24/2016
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14643264
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03/10/2015
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07/02/2015
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Title:
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REDUCED STRESS TSV AND INTERPOSER STRUCTURES
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05/02/2017
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14645811
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03/12/2015
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09/15/2016
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Title:
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REDUCED LOAD MEMORY MODULE USING WIRE BONDS AND A PLURALITY OF RANK SIGNALS
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03/06/2018
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14658763
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03/16/2015
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07/02/2015
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Title:
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STACKABLE MICROELECTRONIC PACKAGE STRUCTURES
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12/22/2015
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14669540
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03/26/2015
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07/30/2015
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MICROELECTRONIC UNIT AND PACKAGE WITH POSITIONAL REVERSAL
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10/11/2016
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14679735
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04/06/2015
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08/27/2015
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Title:
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MULTIPLE DIE IN A FACE DOWN PACKAGE
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06/28/2016
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14679985
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04/06/2015
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11/12/2015
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Title:
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Method of making a stacked microelectronic package
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03/29/2016
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14683687
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04/10/2015
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07/30/2015
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Title:
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RETENTION OPTIMIZED MEMORY DEVICE USING PREDICTIVE DATA INVERSION
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05/31/2016
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14686222
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04/14/2015
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08/06/2015
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NON-LITHOGRAPHIC FORMATION OF THREE-DIMENSIONAL CONDUCTIVE ELEMENTS
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09/06/2016
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14689346
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04/17/2015
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08/06/2015
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MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE
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05/02/2017
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14690935
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04/20/2015
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08/13/2015
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ROOM CHARACTERIZATION AND CORRECTION FOR MULTI-CHANNEL AUDIO
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03/07/2017
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14697460
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04/27/2015
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08/13/2015
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Title:
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SUBSTRATES WITH THROUGH VIAS WITH CONDUCTIVE FEATURES FOR CONNECTION TO INTEGRATED CIRCUIT ELEMENTS, AND METHODS FOR FORMING THROUGH VIAS IN SUBSTRATES
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NONE
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14700780
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04/30/2015
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08/20/2015
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ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
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01/17/2017
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14704714
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05/05/2015
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06/09/2016
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Title:
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INTEGRATED CIRCUIT ASSEMBLIES WITH RIGID LAYERS USED FOR PROTECTION AGAINST MECHANICAL THINNING AND FOR OTHER PURPOSES, AND METHODS OF FABRICATING SUCH ASSEMBLIES
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07/19/2016
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14707465
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05/08/2015
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08/27/2015
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Title:
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MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
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05/23/2017
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14708989
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05/11/2015
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09/03/2015
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Title:
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MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
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09/13/2016
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14709011
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05/11/2015
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08/27/2015
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Title:
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Z-CONNECTION FOR A MICROELECTRONIC PACKAGE USING ELECTROLESS PLATING
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04/19/2016
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14716791
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05/19/2015
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Pub Dt:
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09/10/2015
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
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09/12/2017
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14718719
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05/21/2015
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Pub Dt:
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09/10/2015
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Title:
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PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
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08/08/2017
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14720605
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05/22/2015
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11/19/2015
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Title:
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SPATIAL AUDIO ENCODING AND REPRODUCTION OF DIFFUSE SOUND
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05/31/2016
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14722672
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05/27/2015
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Pub Dt:
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09/10/2015
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Title:
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METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING
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02/20/2018
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14725975
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05/29/2015
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Pub Dt:
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11/19/2015
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Title:
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OFF-CHIP VIAS IN STACKED CHIPS
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NONE
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14727810
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06/01/2015
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Pub Dt:
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09/17/2015
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Title:
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LIGHT EMITTING DEVICE HAVING AN OPTICAL ENHANCEMENT LAYER COMPRISING AN ELECTRICALLY CONDUCTIVE CORE SURROUNDED BY AN ELECTRICALLY INSULATING SHELL FORMED ON A TOP SEMICONDUCTOR LAYER
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03/28/2017
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14729729
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06/03/2015
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Pub Dt:
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09/24/2015
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Title:
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METHOD AND STRUCTURES FOR VIA SUBSTRATE REPAIR AND ASSEMBLY
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03/15/2016
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14731251
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06/04/2015
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Pub Dt:
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10/01/2015
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Title:
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SINGLE EXPOSURE IN MULTI-DAMASCENE PROCESS
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12/04/2018
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14733269
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06/08/2015
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Pub Dt:
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09/24/2015
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Title:
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CAPACITORS USING POROUS ALUMINA STRUCTURES
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01/10/2017
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14733780
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06/08/2015
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Pub Dt:
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12/03/2015
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Title:
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ACTUATOR FOR MOTION CONTROL IN MINIATURE CAMERAS
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Issue Dt:
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03/21/2017
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14740184
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06/15/2015
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Pub Dt:
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12/17/2015
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Title:
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ELECTRICALLY STACKABLE SEMICONDUCTOR WAFER AND CHIP PACKAGES
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02/07/2017
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14746425
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06/22/2015
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Pub Dt:
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10/08/2015
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Title:
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THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
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02/20/2018
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14746724
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06/22/2015
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Pub Dt:
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12/24/2015
| | | | |
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Title:
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MINIATURE MEMS ACTUATOR ASSEMBLIES
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08/04/2020
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14749757
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Filing Dt:
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06/25/2015
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Publication #:
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Pub Dt:
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10/15/2015
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Title:
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SYSTEM AND METHOD FOR TRANSMITTING DIGITAL MULTIMEDIA DATA WITH ANALOG BROADCAST DATA
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Issue Dt:
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10/04/2016
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14753607
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Filing Dt:
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06/29/2015
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Publication #:
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Pub Dt:
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10/22/2015
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Title:
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SINGLE PACKAGE DUAL CHANNEL MEMORY WITH CO-SUPPORT
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Issue Dt:
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01/17/2017
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14753895
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Filing Dt:
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06/29/2015
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Publication #:
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Pub Dt:
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12/31/2015
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Title:
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PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
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Patent #:
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05/03/2016
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14754111
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06/29/2015
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Publication #:
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Pub Dt:
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10/22/2015
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Title:
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METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
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Patent #:
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Issue Dt:
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09/27/2016
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Application #:
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14754293
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Filing Dt:
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06/29/2015
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Publication #:
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Pub Dt:
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10/22/2015
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Title:
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Bowl-shaped solder structure
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Patent #:
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Issue Dt:
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08/08/2017
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Application #:
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14775119
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Filing Dt:
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09/11/2015
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Publication #:
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Pub Dt:
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02/04/2016
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Title:
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RECONFIGURABLE POP
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Patent #:
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Issue Dt:
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10/25/2016
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Application #:
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14798200
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Filing Dt:
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07/13/2015
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Publication #:
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Pub Dt:
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11/05/2015
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Title:
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Auto-Focus Camera Module with MEMS Capacitance Estimator
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Patent #:
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Issue Dt:
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05/23/2017
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14801259
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Filing Dt:
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07/16/2015
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Publication #:
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Pub Dt:
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11/12/2015
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Title:
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LOW-STRESS VIAS
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Patent #:
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Issue Dt:
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07/24/2018
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14801652
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Filing Dt:
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07/16/2015
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Publication #:
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Pub Dt:
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02/11/2016
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Title:
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IMMERSIVE AUDIO RENDERING SYSTEM
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Patent #:
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Issue Dt:
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06/28/2016
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14806993
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07/23/2015
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Publication #:
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Pub Dt:
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11/12/2015
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Title:
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METHOD OF THINNING A WAFER TO PROVIDE A RAISED PERIPHERAL EDGE
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Patent #:
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Issue Dt:
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05/30/2017
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14809036
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07/24/2015
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Publication #:
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Pub Dt:
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03/10/2016
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Title:
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MULTICHIP MODULES AND METHODS OF FABRICATION
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01/31/2017
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14809117
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07/24/2015
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Pub Dt:
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11/19/2015
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Title:
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ELECTRICAL BARRIER LAYERS
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Patent #:
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Issue Dt:
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04/04/2017
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14809570
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Filing Dt:
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07/27/2015
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Publication #:
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Pub Dt:
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11/19/2015
| | | | |
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Title:
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MICROELECTRONIC ASSEMBLY FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAPSULATION SURFACE
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Patent #:
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Issue Dt:
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06/14/2016
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Application #:
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14811177
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Filing Dt:
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07/28/2015
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Publication #:
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Pub Dt:
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11/19/2015
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Title:
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STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PLURAL ACTIVE CHIPS
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Patent #:
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Issue Dt:
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07/25/2017
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Application #:
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14813972
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Filing Dt:
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07/30/2015
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Publication #:
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Pub Dt:
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11/26/2015
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Title:
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3D IC METHOD AND DEVICE
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Patent #:
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Issue Dt:
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04/19/2016
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Application #:
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14814344
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Filing Dt:
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07/30/2015
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Publication #:
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Pub Dt:
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01/28/2016
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Title:
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SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STRUCTURES
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Patent #:
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04/25/2017
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14814781
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Filing Dt:
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07/31/2015
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Publication #:
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Pub Dt:
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11/26/2015
| | | | |
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Title:
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MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRONIC ELEMENTS
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Patent #:
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Issue Dt:
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06/20/2017
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14815282
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Filing Dt:
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07/31/2015
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Publication #:
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Pub Dt:
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11/26/2015
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Title:
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STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
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Patent #:
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Issue Dt:
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10/25/2016
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Application #:
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14817423
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Filing Dt:
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08/04/2015
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Publication #:
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Pub Dt:
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11/26/2015
| | | | |
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Title:
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METHOD AND APPARATUS FOR TRANSMISSION AND RECEPTION OF IN-BAND ON-CHANNEL RADIO SIGNALS INCLUDING COMPLEMENTARY LOW DENSITY PARITY CHECK CODING
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Patent #:
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Issue Dt:
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10/25/2016
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Application #:
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14817423
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Filing Dt:
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08/04/2015
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Publication #:
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Pub Dt:
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11/26/2015
| | | | |
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Title:
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METHOD AND APPARATUS FOR TRANSMISSION AND RECEPTION OF IN-BAND ON-CHANNEL RADIO SIGNALS INCLUDING COMPLEMENTARY LOW DENSITY PARITY CHECK CODING
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Patent #:
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Issue Dt:
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12/06/2016
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Application #:
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14824520
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Filing Dt:
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08/12/2015
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Publication #:
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Pub Dt:
|
12/03/2015
| | | | |
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Title:
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STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR
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Patent #:
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Issue Dt:
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03/28/2017
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Application #:
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14824998
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Filing Dt:
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08/12/2015
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Publication #:
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Pub Dt:
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08/18/2016
| | | | |
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Title:
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MULTI-RATE SYSTEM FOR AUDIO PROCESSING
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14828281
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Filing Dt:
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08/17/2015
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Publication #:
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Pub Dt:
|
12/10/2015
| | | | |
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Title:
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METHOD OF FORMING A CMOS STRUCTURE HAVING GATE INSULATION FILMS OF DIFFERENT THICKNESSES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14829218
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Filing Dt:
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08/18/2015
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Publication #:
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Pub Dt:
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03/17/2016
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Title:
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METHOD FOR PROVIDING AND OBTAINING CONTENT
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Issue Dt:
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07/11/2017
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Application #:
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14829511
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Filing Dt:
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08/18/2015
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Publication #:
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Pub Dt:
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03/31/2016
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Title:
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ON-CHIP IMPEDANCE NETWORK WITH DIGITAL COARSE AND ANALOG FINE TUNING
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Patent #:
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Issue Dt:
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09/13/2016
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Application #:
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14829810
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Filing Dt:
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08/19/2015
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Publication #:
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Pub Dt:
|
12/10/2015
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Title:
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FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
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Issue Dt:
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11/29/2016
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14833979
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Filing Dt:
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08/24/2015
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Pub Dt:
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02/18/2016
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Title:
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MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT PACKAGES
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Patent #:
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Issue Dt:
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09/06/2016
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Application #:
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14834035
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Filing Dt:
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08/24/2015
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Pub Dt:
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12/17/2015
| | | | |
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Title:
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DUAL SENSOR CAMERA
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Patent #:
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Issue Dt:
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08/16/2016
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14834166
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Filing Dt:
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08/24/2015
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Publication #:
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Pub Dt:
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12/17/2015
| | | | |
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Title:
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DUAL SENSOR CAMERA
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Patent #:
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Issue Dt:
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02/14/2017
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14834803
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Filing Dt:
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08/25/2015
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Pub Dt:
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12/17/2015
| | | | |
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Title:
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STACKABLE MOLDED MICROELECTRONIC PACKAGES
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Patent #:
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Issue Dt:
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05/31/2016
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14837561
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Filing Dt:
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08/27/2015
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Pub Dt:
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12/24/2015
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Title:
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MICROELECTRONIC PACKAGE WITH CONSOLIDATED CHIP STRUCTURES
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Patent #:
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Issue Dt:
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03/22/2016
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14837576
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Filing Dt:
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08/27/2015
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Publication #:
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Pub Dt:
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12/17/2015
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Title:
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CO-SUPPORT FOR XFD PACKAGING
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Issue Dt:
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02/28/2017
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14841381
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Filing Dt:
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08/31/2015
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Publication #:
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Pub Dt:
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12/31/2015
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Title:
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Multiple bond via arrays of different wire heights on a same substrate
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Issue Dt:
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08/22/2017
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14843726
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09/02/2015
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Pub Dt:
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03/10/2016
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Title:
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USING BIOMETRIC USER-SPECIFIC ATTRIBUTES
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Issue Dt:
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08/01/2017
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14844994
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09/03/2015
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Pub Dt:
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04/14/2016
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Title:
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SYSTEM FOR DYNAMICALLY CREATING AND RENDERING AUDIO OBJECTS
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Patent #:
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Issue Dt:
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03/21/2017
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Application #:
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14850500
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Filing Dt:
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09/10/2015
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Publication #:
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Pub Dt:
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12/31/2015
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Title:
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METHOD OF FORMING A COMPONENT HAVING WIRE BONDS AND A STIFFENING LAYER
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Patent #:
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Issue Dt:
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07/25/2017
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Application #:
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14851925
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Filing Dt:
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09/11/2015
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Pub Dt:
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01/07/2016
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY AND METHOD FOR MAKING SAME
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Patent #:
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Issue Dt:
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10/24/2017
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Application #:
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14852855
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Filing Dt:
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09/14/2015
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Publication #:
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Pub Dt:
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03/17/2016
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Title:
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SEMICONDUCTOR PACKAGES AND OTHER CIRCUIT MODULES WITH POROUS AND NON-POROUS STABILIZING LAYERS
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Patent #:
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Issue Dt:
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11/08/2016
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Application #:
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14868090
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Filing Dt:
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09/28/2015
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Publication #:
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Pub Dt:
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01/21/2016
| | | | |
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Title:
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SELECTIVE DIE ELECTRICAL INSULATION BY ADDITIVE PROCESS
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Patent #:
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Issue Dt:
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10/29/2019
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Application #:
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14870823
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Filing Dt:
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09/30/2015
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Publication #:
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Pub Dt:
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01/21/2016
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Title:
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METHOD OF MANUFACTURING EMBEDDED PACKAGING WITH PREFORMED VIAS
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Patent #:
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Issue Dt:
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02/14/2017
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Application #:
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14870827
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Filing Dt:
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09/30/2015
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Publication #:
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Pub Dt:
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02/04/2016
| | | | |
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Title:
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STACKED PACKAGING IMPROVEMENTS
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Patent #:
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Issue Dt:
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11/29/2016
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Application #:
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14871185
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Filing Dt:
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09/30/2015
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Pub Dt:
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01/28/2016
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Title:
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ELECTRICAL CONNECTOR BETWEEN DIE PAD AND Z-INTERCONNECT FOR STACKED DIE ASSEMBLIES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14874095
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Filing Dt:
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10/02/2015
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Publication #:
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Pub Dt:
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04/06/2017
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Title:
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METHOD AND SYSTEM FOR AUDIO PROCESSING OF DIALOG, MUSIC, EFFECT AND HEIGHT OBJECTS
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Patent #:
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Issue Dt:
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01/24/2017
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14878548
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Filing Dt:
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10/08/2015
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Publication #:
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Pub Dt:
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03/24/2016
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Title:
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STACKABLE MOLDED MICROELECTRONIC PACKAGES WITH AREA ARRAY UNIT CONNECTORS
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Patent #:
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Issue Dt:
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07/04/2017
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Application #:
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14879800
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Filing Dt:
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10/09/2015
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Publication #:
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Pub Dt:
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04/07/2016
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Title:
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HETEROGENEOUS ANNEALING METHOD AND DEVICE
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