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08/13/2002
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09735792
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12/14/2000
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Pub Dt:
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10/04/2001
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Title:
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PRINTED WIRING BOARD, IC CARD MODULE USING THE SAME, AND METHOD FOR PRODUCING IC CARD MODULE
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06/18/2002
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09735980
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12/13/2000
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Title:
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05/31/2005
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09747143
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12/22/2000
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06/07/2001
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Title:
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SYSTEM AND METHOD FOR MITIGATING INTERMITTENT INTERRUPTIONS IN AN AUDIO RADIO BROADCAST SYSTEM
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05/21/2002
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09748140
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12/27/2000
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08/16/2001
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Title:
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SEMICONDUCTOR MEMORY DEVICE HAVING A MULTI-LAYER INTERCONNECTION STRUCTURE SUITABLE FOR MERGING WITH LOGIC
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10/09/2001
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09750214
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12/27/2000
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Title:
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Asynchronous memory self time scheme
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06/04/2002
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09750759
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01/02/2001
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01/17/2002
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Title:
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SEMICONDUCTOR DEVICE
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10/26/2004
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09751979
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12/29/2000
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07/19/2001
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Title:
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MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING SIMULTANEOUS FORMATION OF VIA HOLE REACHING METAL WIRING AND CONCAVE GROOVE IN INTERLAYER FILM AND SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURED WITH THE MANUFACTURING METHOD
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09/10/2002
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09752802
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12/28/2000
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05/17/2001
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Title:
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THINNING AND DICING OF SEMICONDUCTOR WAFERS USING DRY ETCH, AND OBTAINING SEMICONDUCTOR CHIPS WITH ROUNDED BOTTOM EDGES AND CORNERS
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05/07/2002
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09753561
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01/04/2001
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05/10/2001
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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12/23/2003
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09757242
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01/08/2001
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06/07/2001
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BIRM AND GAS ESCAPE FOR NON-CONTACT WAFER HOLDER
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08/20/2002
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09757897
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01/10/2001
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05/31/2001
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Title:
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MICROELECTRONIC CONNECTIONS WITH LIQUID CONDUCTIVE ELEMENTS
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09/23/2003
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09758906
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01/11/2001
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05/01/2003
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Title:
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PACKAGED INTEGRATED CIRCUITS AND METHODS OF PRODUCING THEREOF
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03/26/2002
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09764590
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01/17/2001
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Title:
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Employing an acidic liquid and an abrasive surface to polish a semiconductor topography
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Issue Dt:
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10/01/2002
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09765030
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01/17/2001
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07/18/2002
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Title:
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CONDUCTIVE ADHESIVE INTERCONNECTION WITH INSULATING POLYMER CARRIER
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01/07/2003
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09766645
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01/23/2001
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09/27/2001
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Title:
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METHOD OF FABRICATING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A CONNECTION BETWEEN A SEMICONDUCTOR REGION AND ELECTRICAL WIRING METAL VIA A TITANIUM SILICIDE LAYER
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02/01/2005
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09766814
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01/22/2001
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06/06/2002
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MICROELECTRONIC PACKAGES HAVING DEFORMED BONDED LEADS AND METHODS THEREFOR
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07/19/2005
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09768372
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01/23/2001
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06/28/2001
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Title:
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STRESS ACCOMMODATION IN ELECTRONIC DEVICE INTERCONNECT TECHNOLOGY FOR MILLIMETER CONTACT LOCATIONS
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04/09/2002
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09768908
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01/23/2001
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07/12/2001
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Title:
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Single-Port multi-bank memory system having read and write buffers and method of operating same
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06/03/2003
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09771412
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01/26/2001
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12/06/2001
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Title:
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MICROELECTRONICS COMPONENT WITH RIGID INTERPOSER
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01/15/2002
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09771548
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01/30/2001
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07/12/2001
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Title:
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Resin-molded semicondutor device, method for manufacturing the same, and leadframe
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10/22/2002
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09772434
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01/29/2001
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Pub Dt:
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12/20/2001
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Title:
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REDUCED TOPOGRAPHY DRAM CELL FABRICATED USING A MODIFIED LOGIC PROCESS AND METHOD FOR OPERATING SAME
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03/02/2004
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09776356
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02/02/2001
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07/05/2001
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Title:
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STACKED MICROELECTRONIC ASSEMBLY AND METHOD THEREFOR
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04/01/2003
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09777781
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02/06/2001
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07/05/2001
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Title:
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COMPONENTS WITH RELEASABLE LEADS AND METHODS OF MAKING RELEASABLE LEADS
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10/15/2002
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09777782
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02/06/2001
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07/12/2001
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COMPLIANT MICROELECTRONIC ASSEMBLIES
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12/16/2003
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09778702
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02/07/2001
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07/12/2001
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FULL ADDITIVE PROCESS WITH FILLED PLATED THROUGH HOLES
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06/20/2006
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09778849
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02/08/2001
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10/10/2002
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METHOD FOR PROCESSING A DIGITAL IMAGE
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03/02/2004
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09779117
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02/08/2001
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08/09/2001
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ELECTRICAL CONNECTION WITH INWARDLY DEFORMABLE CONTACTS
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02/01/2005
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09779123
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02/07/2001
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08/08/2002
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PLANARIZED SEMICONDUCTOR INTERCONNECT TOPOGRAPHY AND METHOD FOR POLISHING A METAL LAYER TO FORM INTERCONNECT
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08/20/2002
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09781252
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02/13/2001
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08/16/2001
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SEMICONDUCTOR DEVICE
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09/17/2002
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09781866
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02/12/2001
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LAYOUT OF VDD AND VSS BALLS IN A FOUR LAYER PBGA
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06/14/2005
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09785104
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02/16/2001
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07/26/2001
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MICROELECTRONIC ELEMENTS WITH DEFORMABLE LEADS
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08/09/2005
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09787526
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12/30/2002
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SEMICONDUCTOR DEVICE PROVIDED WITH REWIRING LAYER
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03/26/2002
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09791245
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02/22/2001
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07/12/2001
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Title:
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Microelectronic mounting with multiple lead deformation using restraining straps
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08/20/2002
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09791800
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02/26/2001
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07/26/2001
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HIGH SPEED AND LOW PARASITIC CAPACITANCE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
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04/06/2004
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09791977
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02/22/2001
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08/22/2002
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DEVICES HAVING SUBSTRATES WITH OPENING PASSING THROUGH THE SUBSTRATES AND CONDUCTORS IN THE OPENINGS, AND METHODS OF MANUFACTURE
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12/24/2002
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09792311
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02/22/2001
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08/22/2002
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SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING, AND METHODS FOR FABRICATING SAME
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09/30/2003
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09795680
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02/27/2001
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SEMICONDUCTOR BLOCKING LAYER FOR PREVENTING UV RADIATION DAMAGE TO MOS GATE OXIDES
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10/14/2003
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09808461
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03/14/2001
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09/19/2002
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COMPONENTS AND METHODS WITH NESTED LEADS
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08/16/2005
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09811401
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03/20/2001
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05/30/2002
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE-MOUNTED STRUCTURE
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04/06/2004
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09811803
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03/19/2001
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12/06/2001
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Title:
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METHODS OF MAKING MICROELECTRONIC ASSEMBLIES USING COMPRESSED RESILIENT LAYER
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05/14/2002
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09818566
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03/28/2001
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09/13/2001
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PROCESS FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
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01/21/2003
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09818917
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03/28/2001
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08/16/2001
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
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05/25/2004
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09822335
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04/02/2001
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09/06/2001
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SELF ALIGNED SYMMETRIC INTRINSIC PROCESS AND DEVICE
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03/08/2005
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09823750
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04/03/2001
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04/04/2002
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SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
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04/12/2005
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09823751
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04/03/2001
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Pub Dt:
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03/21/2002
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PULSE REVERSE ELECTRODEPOSITION FOR METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES
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11/26/2002
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09834077
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04/12/2001
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09/13/2001
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METHOD AND APPARATUS FOR AM DIGITAL BROADCASTING
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09/03/2002
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09835412
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04/17/2001
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10/11/2001
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SUBSTRATE-CLEANING METHOD AND SUBSTRATE-CLEANING SOLUTION
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04/29/2003
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09837816
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04/17/2001
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FOUR CURRENT TRANSISTOR TEMPERATURE SENSOR AND METHOD
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05/23/2006
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09838484
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04/19/2001
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03/21/2002
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SYSTEM FOR MANAGING DATA OBJECTS
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Issue Dt:
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03/15/2011
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09839451
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04/20/2001
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Pub Dt:
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10/03/2002
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SYSTEM AND METHOD FOR GENERATING MULTIMEDIA ACCOMPANIMENTS TO BROADCAST DATA
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07/13/2004
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09844530
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04/27/2001
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Title:
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BALL ASSIGNMENT FOR BALL GRID ARRAY PACKAGE
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01/07/2003
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09846093
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04/30/2001
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Pub Dt:
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10/04/2001
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METHOD AND APPARATUS FOR COMPLETELY HIDING REFRESH OPERATIONS IN A DRAM DEVICE USING CLOCK DIVISION
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09/30/2003
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09848387
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05/03/2001
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Pub Dt:
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12/27/2001
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Title:
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METHOD OF MAKING A MICROELECTRONIC ASSEMBLY WITH MULTIPLE LEAD DEFORMATION USING DIFFERENTIAL THERMAL EXPANSION/CONTRACTION
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05/04/2004
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09848800
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05/04/2001
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Pub Dt:
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04/11/2002
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Title:
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TEST INTERFACE FOR VERIFICATION OF HIGH SPEED EMBEDDED SYNCHRONOUS DYNAMIC RANDOM ACCESS MEMORY (SDRAM) CIRCUITRY
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Issue Dt:
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12/16/2003
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09850973
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05/08/2001
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01/03/2002
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10/13/2009
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12/13/2001
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12/31/2002
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10/25/2001
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07/18/2006
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09/13/2001
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08/05/2003
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06/20/2002
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06/03/2003
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05/16/2001
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06/20/2002
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11/19/2002
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09/16/2003
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09/20/2001
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05/28/2002
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12/06/2001
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03/04/2003
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12/14/2004
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06/26/2001
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09/07/2004
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10/04/2001
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12/24/2002
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06/06/2001
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01/31/2002
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06/13/2001
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08/15/2002
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04/12/2005
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06/19/2001
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12/27/2001
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02/03/2004
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06/20/2001
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01/24/2002
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05/11/2004
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01/31/2002
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11/19/2002
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12/06/2001
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06/11/2002
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01/17/2002
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10/28/2003
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06/27/2002
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05/20/2003
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02/14/2002
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04/01/2003
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02/07/2002
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03/07/2002
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02/21/2002
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11/29/2001
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10/22/2002
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03/07/2002
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07/22/2003
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08/20/2001
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01/24/2002
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02/21/2006
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01/18/2005
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08/22/2002
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02/01/2005
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08/29/2001
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04/11/2002
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09/23/2008
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08/31/2001
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03/04/2003
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08/31/2001
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10/29/2002
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08/31/2001
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07/06/2004
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01/31/2002
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03/07/2002
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