|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/14/2006
|
Application #:
|
10452333
|
Filing Dt:
|
06/02/2003
|
|
Publication #:
|
|
Pub Dt:
|
02/19/2004
| | | | |
|
Title:
|
MICROELECTRONIC ASSEMBLIES INCORPORATING INDUCTORS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10452874
|
Filing Dt:
|
06/02/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/02/2003
| | | | |
|
Title:
|
DESIGNING A BALL ASSIGNMENT FOR A BALL GRID ARRAY PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/20/2005
|
Application #:
|
10454029
|
Filing Dt:
|
06/04/2003
|
|
Publication #:
|
|
Pub Dt:
|
02/19/2004
| | | | |
|
Title:
|
STACKED PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/10/2006
|
Application #:
|
10454258
|
Filing Dt:
|
06/03/2003
|
|
Publication #:
|
|
Pub Dt:
|
12/09/2004
| | | | |
|
Title:
|
SUBSTRATE ALIGNMENT METHOD AND APPARATUS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2006
|
Application #:
|
10460418
|
Filing Dt:
|
06/13/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/13/2003
| | | | |
|
Title:
|
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2005
|
Application #:
|
10462576
|
Filing Dt:
|
06/16/2003
|
|
Publication #:
|
|
Pub Dt:
|
12/16/2004
| | | | |
|
Title:
|
METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2007
|
Application #:
|
10465443
|
Filing Dt:
|
06/19/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR FORMATTING SIGNALS FOR DIGITAL AUDIO BROADCASTING TRANSMISSION AND RECEPTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/03/2012
|
Application #:
|
10471608
|
Filing Dt:
|
03/19/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/19/2004
| | | | |
|
Title:
|
Information delivery system for generating a data stream with a server system based on a content file received from a client device
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2006
|
Application #:
|
10474863
|
Filing Dt:
|
10/08/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
|
Title:
|
SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2005
|
Application #:
|
10482012
|
Filing Dt:
|
12/23/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/09/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/12/2013
|
Application #:
|
10484518
|
Filing Dt:
|
12/02/2004
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2005
| | | | |
|
Title:
|
SYSTEM AND METHOD FOR TRANSMITTING DIGITAL MULTIMEDIA DATA WITH ANALOG BROADCAST DATA
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/20/2009
|
Application #:
|
10487482
|
Filing Dt:
|
09/17/2004
|
|
Publication #:
|
|
Pub Dt:
|
02/17/2005
| | | | |
|
Title:
|
STACKED CHIP ASSEMBLY WITH ENCAPSULANT LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2009
|
Application #:
|
10488210
|
Filing Dt:
|
10/13/2004
|
|
Publication #:
|
|
Pub Dt:
|
03/03/2005
| | | | |
|
Title:
|
HIGH-FREQUENCY CHIP PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2006
|
Application #:
|
10516647
|
Filing Dt:
|
12/01/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/11/2005
| | | | |
|
Title:
|
QUAD FLAT NON-LEADED PACKAGE COMPRISING A SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/18/2008
|
Application #:
|
10525804
|
Filing Dt:
|
02/25/2005
|
|
Publication #:
|
|
Pub Dt:
|
10/20/2005
| | | | |
|
Title:
|
VERSION-PROGRAMMABLE CIRCUIT MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2008
|
Application #:
|
10534165
|
Filing Dt:
|
05/05/2005
|
|
Publication #:
|
|
Pub Dt:
|
07/20/2006
| | | | |
|
Title:
|
DATA CARRIER WITH A MODULE WITH A REINFORCEMENT STRIP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/25/2009
|
Application #:
|
10538281
|
Filing Dt:
|
06/10/2005
|
|
Publication #:
|
|
Pub Dt:
|
01/26/2006
| | | | |
|
Title:
|
WIREBONDING METHOD AND APPARATUS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2007
|
Application #:
|
10538378
|
Filing Dt:
|
06/13/2005
|
|
Publication #:
|
|
Pub Dt:
|
05/25/2006
| | | | |
|
Title:
|
COARSE DELAY TUNER CIRCUITS WITH EDGE SUPPRESSORS IN DELAY LOCKED LOOPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2009
|
Application #:
|
10541967
|
Filing Dt:
|
06/23/2006
|
|
Publication #:
|
|
Pub Dt:
|
11/16/2006
| | | | |
|
Title:
|
CAMERA WITH IMAGE ENHANCEMENT FUNCTIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/05/2010
|
Application #:
|
10555755
|
Filing Dt:
|
04/28/2008
|
|
Publication #:
|
|
Pub Dt:
|
08/21/2008
| | | | |
|
Title:
|
METHOD AND ARRANGEMENT FOR SETTING THE TRANSMISSION OF A MOBILE COMMUNICATION DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2016
|
Application #:
|
10560717
|
Filing Dt:
|
12/15/2005
|
|
Publication #:
|
|
Pub Dt:
|
06/22/2006
| | | | |
|
Title:
|
ELECTRONIC DEVICE, ASSEMBLY AND METHODS OF MANUFACTURING AN ELECTRONIC DEVICE INCLUDING A VERTICAL TRENCH CAPACITOR AND A VERTICAL INTERCONNECT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2008
|
Application #:
|
10566552
|
Filing Dt:
|
01/27/2006
|
|
Publication #:
|
|
Pub Dt:
|
08/24/2006
| | | | |
|
Title:
|
INTERGRATED CIRCUIT WITH DYNAMIC COMMUNICATION SERVICE SELECTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2009
|
Application #:
|
10570446
|
Filing Dt:
|
03/02/2006
|
|
Publication #:
|
|
Pub Dt:
|
01/25/2007
| | | | |
|
Title:
|
METHOD OF ACQUIRING A RECEIVED SPREAD SPECTRUM SIGNAL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2009
|
Application #:
|
10575581
|
Filing Dt:
|
04/11/2006
|
|
Publication #:
|
|
Pub Dt:
|
03/08/2007
| | | | |
|
Title:
|
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/19/2009
|
Application #:
|
10575773
|
Filing Dt:
|
04/12/2006
|
|
Publication #:
|
|
Pub Dt:
|
02/08/2007
| | | | |
|
Title:
|
TIME BASE ADJUSTMENT IN A DATA PROCESSING DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2008
|
Application #:
|
10576570
|
Filing Dt:
|
04/19/2006
|
|
Publication #:
|
|
Pub Dt:
|
06/28/2007
| | | | |
|
Title:
|
METHOD AND SYSTEM FOR POWERING AN INTEGRATED CIRCUIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2007
|
Application #:
|
10607274
|
Filing Dt:
|
06/27/2003
|
|
Publication #:
|
|
Pub Dt:
|
02/26/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/29/2005
|
Application #:
|
10607289
|
Filing Dt:
|
06/26/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
|
Title:
|
METHODS OF MAKING MICROELECTRONIC PACKAGES INCLUDING ELECTRICALLY AND/OR THERMALLY CONDUCTIVE ELEMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/21/2006
|
Application #:
|
10608295
|
Filing Dt:
|
06/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
03/18/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/04/2005
|
Application #:
|
10611390
|
Filing Dt:
|
07/01/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2004
| | | | |
|
Title:
|
ASSEMBLIES HAVING STACKED SEMICONDUCTOR CHIPS AND METHODS OF MAKING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2005
|
Application #:
|
10614069
|
Filing Dt:
|
07/03/2003
|
|
Publication #:
|
|
Pub Dt:
|
03/04/2004
| | | | |
|
Title:
|
METHOD OF MAKING A MICROELECTRONIC ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2006
|
Application #:
|
10614642
|
Filing Dt:
|
07/07/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/26/2004
| | | | |
|
Title:
|
METHOD AND SYSTEM OF TESTING DATA RETENTION OF MEMORY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/15/2005
|
Application #:
|
10616981
|
Filing Dt:
|
07/11/2003
|
|
Publication #:
|
|
Pub Dt:
|
01/29/2004
| | | | |
|
Title:
|
SEMICONDUCTOR CHIP, WIRING BOARD AND MANUFACTURING PROCESS THEREOF AS WELL AS SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/21/2006
|
Application #:
|
10623849
|
Filing Dt:
|
07/22/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2004
| | | | |
|
Title:
|
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2006
|
Application #:
|
10625616
|
Filing Dt:
|
07/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/04/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE INCLUDING N-CHANNEL FETS AND P-CHANNEL FETS WITH IMPROVED DRAIN CURRENT CHARACTERISTICS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2005
|
Application #:
|
10626366
|
Filing Dt:
|
07/23/2003
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE AND METHOD FOR A PBGA PACKAGE HAVING A MULTIPLICITY OF STAGGERED POWER RING SEGMENTS FOR POWER CONNECTION TO INTEGRATED CIRCUIT DIE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2008
|
Application #:
|
10627057
|
Filing Dt:
|
07/25/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/08/2004
| | | | |
|
Title:
|
RF SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2005
|
Application #:
|
10639086
|
Filing Dt:
|
08/12/2003
|
|
Publication #:
|
|
Pub Dt:
|
02/17/2005
| | | | |
|
Title:
|
STRUCTURE AND METHOD OF MAKING AN ENHANCED SURFACE AREA CAPACITOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10640177
|
Filing Dt:
|
08/13/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/03/2004
| | | | |
|
Title:
|
MICROELECTRONIC PACKAGES WITH SELF-ALIGNING FEATURES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2005
|
Application #:
|
10643701
|
Filing Dt:
|
08/19/2003
|
|
Publication #:
|
|
Pub Dt:
|
09/02/2004
| | | | |
|
Title:
|
COMPLIANT PACKAGE WITH CONDUCTIVE ELASTOMERIC POSTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2006
|
Application #:
|
10649741
|
Filing Dt:
|
08/28/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/01/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2007
|
Application #:
|
10654375
|
Filing Dt:
|
09/03/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/17/2004
| | | | |
|
Title:
|
METHODS OF MAKING MICROELECTRONIC PACKAGES INCLUDING FOLDED SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2006
|
Application #:
|
10655952
|
Filing Dt:
|
09/05/2003
|
|
Publication #:
|
|
Pub Dt:
|
05/27/2004
| | | | |
|
Title:
|
ASSEMBLIES HAVING STACKED SEMICONDUCTOR CHIPS AND METHODS OF MAKING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2007
|
Application #:
|
10656534
|
Filing Dt:
|
09/05/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/29/2004
| | | | |
|
Title:
|
COMPONENTS, METHODS AND ASSEMBLIES FOR STACKED PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/09/2005
|
Application #:
|
10658177
|
Filing Dt:
|
09/09/2003
|
|
Publication #:
|
|
Pub Dt:
|
03/11/2004
| | | | |
|
Title:
|
LOW COST AND COMPLIANT MICROELECTRONIC PACKAGES FOR HIGH I/O AND FINE PITCH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2005
|
Application #:
|
10658941
|
Filing Dt:
|
09/10/2003
|
|
Publication #:
|
|
Pub Dt:
|
03/11/2004
| | | | |
|
Title:
|
A METHOD FOR MAKING A MICROELECTRONIC INTERPOSER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2005
|
Application #:
|
10665148
|
Filing Dt:
|
09/22/2003
|
|
Publication #:
|
|
Pub Dt:
|
03/18/2004
| | | | |
|
Title:
|
ETCHING AND CLEANING METHODS AND ETCHING AND CLEANING APPARATUSES USED THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2006
|
Application #:
|
10666775
|
Filing Dt:
|
09/18/2003
|
|
Publication #:
|
|
Pub Dt:
|
03/24/2005
| | | | |
|
Title:
|
I/C CHIP SUITABLE FOR WIRE BONDING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2008
|
Application #:
|
10672441
|
Filing Dt:
|
09/26/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/01/2004
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR INTERLEAVING SIGNAL BITS IN A DIGITAL AUDIO BROADCASTING SYSTEM
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2009
|
Application #:
|
10677604
|
Filing Dt:
|
10/02/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/07/2005
| | | | |
|
Title:
|
METHOD OF FORMING LOW WIRE LOOPS AND WIRE LOOPS FORMED USING THE METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2007
|
Application #:
|
10681718
|
Filing Dt:
|
10/08/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/14/2005
| | | | |
|
Title:
|
HEARING AJUSTMENT APPLIANCE FOR ELECTRONIC AUDIO EQUIPMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10683097
|
Filing Dt:
|
10/10/2003
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2004
| | | | |
|
Title:
|
COMPONENTS, METHODS AND ASSEMBLIES FOR MULTI-CHIP PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/26/2005
|
Application #:
|
10685361
|
Filing Dt:
|
10/14/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/22/2004
| | | | |
|
Title:
|
SEMICONDUCTOR CHIP PACKAGE WITH INTERCONNECT STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/15/2005
|
Application #:
|
10688910
|
Filing Dt:
|
10/21/2003
|
|
Title:
|
SINGLE MASK VIA METHOD AND DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2006
|
Application #:
|
10689642
|
Filing Dt:
|
10/22/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/29/2004
| | | | |
|
Title:
|
LEADFRAME, PLASTIC-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2006
|
Application #:
|
10699328
|
Filing Dt:
|
10/31/2003
|
|
Publication #:
|
|
Pub Dt:
|
11/04/2004
| | | | |
|
Title:
|
MICROELECTRONIC ASSEMBLIES HAVING LOW PROFILE CONNECTIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2006
|
Application #:
|
10707293
|
Filing Dt:
|
12/03/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/28/2004
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR TRANSFERRING SOLDER BUMPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2006
|
Application #:
|
10708649
|
Filing Dt:
|
03/17/2004
|
|
Publication #:
|
|
Pub Dt:
|
09/22/2005
| | | | |
|
Title:
|
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS OF SEED LAYER UNDERETCHING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2007
|
Application #:
|
10715582
|
Filing Dt:
|
11/18/2003
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2005
| | | | |
|
Title:
|
COHERENT TRACKING FOR FM IN-BAND ON-CHANNEL RECEIVERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/17/2005
|
Application #:
|
10717342
|
Filing Dt:
|
11/18/2003
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE HAVING BYPASS CAPACITORS COUPLED TO BOTTOM OF PACKAGE SUBSTRATE AND SUPPORTING SURFACE MOUNTING TECHNOLOGY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2006
|
Application #:
|
10718515
|
Filing Dt:
|
11/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
05/27/2004
| | | | |
|
Title:
|
MASTER SLICE SEMICONDUCTOR INTEGRATED CIRCUIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/12/2006
|
Application #:
|
10720958
|
Filing Dt:
|
11/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
05/26/2005
| | | | |
|
Title:
|
ROUTING SCHEME FOR DIFFERENTIAL PAIRS IN FLIP CHIP SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2007
|
Application #:
|
10724258
|
Filing Dt:
|
12/01/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/10/2004
| | | | |
|
Title:
|
CCD IMAGE SENSOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2007
|
Application #:
|
10728306
|
Filing Dt:
|
12/04/2003
|
|
Publication #:
|
|
Pub Dt:
|
04/29/2004
| | | | |
|
Title:
|
METHOD OF MAKING A MICROELECTRONIC PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/2005
|
Application #:
|
10729174
|
Filing Dt:
|
12/05/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/08/2004
| | | | |
|
Title:
|
METHOD OF FORMING FILLED BLIND VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2009
|
Application #:
|
10734776
|
Filing Dt:
|
12/12/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/16/2005
| | | | |
|
Title:
|
SYSTEMS AND METHODS OF SPATIAL IMAGE ENHANCEMENT OF A SOUND SOURCE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2006
|
Application #:
|
10739319
|
Filing Dt:
|
12/19/2003
|
|
Publication #:
|
|
Pub Dt:
|
07/08/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10739707
|
Filing Dt:
|
12/17/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
|
Title:
|
PACKAGING SUBSTRATES FOR INTEGRATED CIRCUITS AND SOLDERING METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/23/2006
|
Application #:
|
10739788
|
Filing Dt:
|
12/17/2003
|
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
|
Title:
|
INTEGRATED CIRCUITS AND PACKAGING SUBSTRATES WITH CAVITIES, AND ATTACHMENT METHODS INCLUDING INSERTION OF PROTRUDING CONTACT PADS INTO CAVITIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/27/2006
|
Application #:
|
10743651
|
Filing Dt:
|
12/22/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
|
Title:
|
ELECTROSTATIC DISCHARGE DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2005
|
Application #:
|
10743783
|
Filing Dt:
|
12/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
|
Title:
|
NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/13/2007
|
Application #:
|
10746810
|
Filing Dt:
|
12/24/2003
|
|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
|
Title:
|
HIGH FREQUENCY CHIP PACKAGES WITH CONNECTING ELEMENTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2005
|
Application #:
|
10747982
|
Filing Dt:
|
12/31/2003
|
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
|
Title:
|
RESIN MOLDED TYPE SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/18/2005
|
Application #:
|
10756121
|
Filing Dt:
|
01/12/2004
|
|
Publication #:
|
|
Pub Dt:
|
07/29/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE WITH FOLDED FILM SUBSTRATE AND DISPLAY DEVICE USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/12/2006
|
Application #:
|
10756631
|
Filing Dt:
|
01/12/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
|
Title:
|
DETECTION AND HANDLING OF SEMICONDUCTOR WAFERS AND WAFER-LIKE OBJECTS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/26/2008
|
Application #:
|
10762318
|
Filing Dt:
|
01/23/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/05/2004
| | | | |
|
Title:
|
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/2008
|
Application #:
|
10764629
|
Filing Dt:
|
01/26/2004
|
|
Publication #:
|
|
Pub Dt:
|
07/28/2005
| | | | |
|
Title:
|
FORWARD ERROR CORRECTION CODING FOR HYBRID AM IN-BAND ON-CHANNEL DIGITAL AUDIO BROADCASTING SYSTEMS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2006
|
Application #:
|
10766892
|
Filing Dt:
|
01/30/2004
|
|
Publication #:
|
|
Pub Dt:
|
09/23/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/02/2009
|
Application #:
|
10770314
|
Filing Dt:
|
02/02/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/04/2005
| | | | |
|
Title:
|
PEAK-TO-AVERAGE POWER REDUCTION FOR FM OFDM TRANSMISSION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/18/2007
|
Application #:
|
10771252
|
Filing Dt:
|
02/03/2004
|
|
Publication #:
|
|
Pub Dt:
|
11/11/2004
| | | | |
|
Title:
|
METHOD FOR MAKING A MICROELECTRONIC PACKAGE USING PRE-PATTERNED, REUSABLE MOLD AND METHOD FOR MAKING THE MOLD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/11/2006
|
Application #:
|
10771728
|
Filing Dt:
|
02/04/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/12/2004
| | | | |
|
Title:
|
METHOD AND PACKAGING STRUCTURE FOR OPTIMIZING WARPAGE OF FLIP CHIP ORGANIC PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/17/2007
|
Application #:
|
10777804
|
Filing Dt:
|
02/12/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/19/2004
| | | | |
|
Title:
|
ASSEMBLIES FOR TEMPORARILY CONNECTING MICROELECTRONIC ELEMENTS FOR TESTING AND METHODS THEREFOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/11/2007
|
Application #:
|
10783314
|
Filing Dt:
|
02/20/2004
|
|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
|
Title:
|
HIGH-FREQUENCY CHIP PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/13/2010
|
Application #:
|
10786825
|
Filing Dt:
|
02/25/2004
|
|
Publication #:
|
|
Pub Dt:
|
01/27/2005
| | | | |
|
Title:
|
MANUFACTURE OF MOUNTABLE CAPPED CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/23/2006
|
Application #:
|
10787437
|
Filing Dt:
|
02/27/2004
|
|
Publication #:
|
|
Pub Dt:
|
08/26/2004
| | | | |
|
Title:
|
METHOD OF MANUFACTURING A DUAL GATE SEMICONDUCTOR DEVICE WITH A POLY-METAL ELECTRODE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/30/2006
|
Application #:
|
10787740
|
Filing Dt:
|
02/27/2004
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2004
| | | | |
|
Title:
|
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/07/2011
|
Application #:
|
10792757
|
Filing Dt:
|
03/05/2004
|
|
Publication #:
|
|
Pub Dt:
|
09/08/2005
| | | | |
|
Title:
|
WAFER SCALE DIE HANDLING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/08/2007
|
Application #:
|
10798053
|
Filing Dt:
|
03/11/2004
|
|
Publication #:
|
|
Pub Dt:
|
09/15/2005
| | | | |
|
Title:
|
METHOD OF FABRICATING A WIRE BOND WITH MULTIPLE STITCH BONDS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2007
|
Application #:
|
10798540
|
Filing Dt:
|
03/10/2004
|
|
Publication #:
|
|
Pub Dt:
|
06/23/2005
| | | | |
|
Title:
|
ATTACHMENT OF INTEGRATED CIRCUIT STRUCTURES AND OTHER SUBSTRATES TO SUBSTRATES WITH VIAS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/20/2005
|
Application #:
|
10801764
|
Filing Dt:
|
03/16/2004
|
|
Publication #:
|
|
Pub Dt:
|
09/09/2004
| | | | |
|
Title:
|
METHOD TO REDUCE NUMBER OF WIRE-BOND LOOP HEIGHTS VERSUS THE TOTAL QUANTITY OF POWER AND SIGNAL RINGS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2005
|
Application #:
|
10817820
|
Filing Dt:
|
04/06/2004
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2004
| | | | |
|
Title:
|
SEMICONDUCTOR INTEGRATED CIRCUIT AND NONVOLATILE MEMORY ELEMENT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2006
|
Application #:
|
10823611
|
Filing Dt:
|
04/14/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2004
| | | | |
|
Title:
|
MANUFACTURING METHOD FOR WIRING CIRCUIT SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2006
|
Application #:
|
10825436
|
Filing Dt:
|
04/16/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2007
|
Application #:
|
10827860
|
Filing Dt:
|
04/20/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/07/2004
| | | | |
|
Title:
|
METHODS FOR MANUFACTURING RESISTORS USING A SACRIFICIAL LAYER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/05/2005
|
Application #:
|
10834342
|
Filing Dt:
|
04/28/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/14/2004
| | | | |
|
Title:
|
STACKED PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/02/2006
|
Application #:
|
10843137
|
Filing Dt:
|
05/11/2004
|
|
Publication #:
|
|
Pub Dt:
|
10/21/2004
| | | | |
|
Title:
|
METHOD FOR FORMING A MULTI-LAYER CIRCUIT ASSEMBLY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/27/2007
|
Application #:
|
10851350
|
Filing Dt:
|
05/24/2004
|
|
Publication #:
|
|
Pub Dt:
|
12/16/2004
| | | | |
|
Title:
|
NON-VOLATILE SEMICONDUCTOR MEMORY AND METHOD OF MAKING SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MAKING DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/19/2008
|
Application #:
|
10856723
|
Filing Dt:
|
05/28/2004
|
|
Publication #:
|
|
Pub Dt:
|
11/04/2004
| | | | |
|
Title:
|
SELECTIVE REMOVAL OF DIELECTRIC MATERIALS AND PLATING PROCESS USING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2006
|
Application #:
|
10866701
|
Filing Dt:
|
06/15/2004
|
|
Publication #:
|
|
Pub Dt:
|
11/11/2004
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/11/2006
|
Application #:
|
10872501
|
Filing Dt:
|
06/22/2004
|
|
Publication #:
|
|
Pub Dt:
|
11/18/2004
| | | | |
|
Title:
|
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
|
|
