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Reel/Frame:040912/0873   Pages: 8
Recorded: 01/10/2017
Attorney Dkt #:JP920140071US2
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/09/2019
Application #:
15402269
Filing Dt:
01/10/2017
Publication #:
Pub Dt:
05/04/2017
Title:
FORMING A SOLDER JOINT BETWEEN METAL LAYERS
Assignors
1
Exec Dt:
08/07/2015
2
Exec Dt:
08/07/2015
3
Exec Dt:
08/07/2015
4
Exec Dt:
08/07/2015
5
Exec Dt:
08/18/2015
6
Exec Dt:
08/18/2015
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM CORP. - FISHKILL DRAFTING CENTER IP
1101 KITCHAWAN RAOD, ROUTE 134
P.O. BOX 218
YORKTOWN, NY 10589

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