Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 041124/0456 | |
| Pages: | 4 |
| | Recorded: | 01/30/2017 | | |
Attorney Dkt #: | 4700.P0420US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/20/2018
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Application #:
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15419091
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Filing Dt:
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01/30/2017
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Publication #:
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Pub Dt:
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09/14/2017
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Title:
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Interconnect Structure, Printed Circuit Board, Semiconductor Device, and Manufacturing Method for Interconnect Structure
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Assignee
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1913-2, AZA-TAKEGASHITA |
OAZA FUKURA |
USUKI-SHI, OITA, JAPAN 875-0053 |
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Correspondence name and address
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FLYNN, THIEL, BOUTELL & TANIS, P.C.
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2026 RAMBLING ROAD
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KALAMAZOO, MI 49008
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