Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 041125/0581 | |
| Pages: | 4 |
| | Recorded: | 01/30/2017 | | |
| Attorney Dkt #: | 6810-863-CON |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13077292
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Filing Dt:
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03/31/2011
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Publication #:
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Pub Dt:
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10/04/2012
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Title:
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METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS
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Patent #:
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Issue Dt:
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08/15/2017
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Application #:
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13574585
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Filing Dt:
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11/12/2012
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Publication #:
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Pub Dt:
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02/28/2013
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Title:
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SYSTEM AND METHOD FOR ASSESSING INHOMOGENEOUS DEFORMATIONS IN MULTILAYER PLATES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14722794
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Filing Dt:
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05/27/2015
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Publication #:
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Pub Dt:
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10/01/2015
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Title:
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METHOD FOR BONDING SEMICONDUCTOR WAFERS USING A MOLECULAR BONDING APPARATUS
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Patent #:
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Issue Dt:
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11/14/2017
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Application #:
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14820729
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Filing Dt:
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08/07/2015
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Publication #:
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Pub Dt:
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12/03/2015
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Title:
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APPARATUS FOR MOLECULAR ADHESION BONDING WITH COMPENSATION FOR RADIAL MISALIGNMENT
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Assignee
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| 4-14-1 ASAHI-CHO |
| ATSUGI-SHI |
| KANAGAWA, JAPAN 243-0014 |
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Correspondence name and address
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SHERIDAN ROSS P.C.
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1560 BROADWAY
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SUITE 1200
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DENVER, CO 80202-5141
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