Patent Assignment Details
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| Reel/Frame: | 041159/0979 | |
| Pages: | 6 |
| | Recorded: | 02/02/2017 | | |
| Attorney Dkt #: | 249/1131_00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/26/2019
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Application #:
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15423027
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Filing Dt:
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02/02/2017
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Publication #:
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Pub Dt:
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01/18/2018
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Title:
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ALUMINUM COMPOUND AND METHODS OF FORMING THIN FILM AND FABRICATING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
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Assignee
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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LEE & MORSE, P.C.
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3141 FAIRVIEW PARK DRIVE
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SUITE 500
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FALLS CHURCH, VA 22042
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