Patent Assignment Details
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| Reel/Frame: | 041167/0601 | |
| Pages: | 7 |
| | Recorded: | 02/03/2017 | | |
| Attorney Dkt #: | 16519 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/02/2019
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Application #:
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15423979
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Filing Dt:
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02/03/2017
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Publication #:
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Pub Dt:
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02/15/2018
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Title:
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BONDED SUBSTRATE, SURFACE ACOUSTIC WAVE ELEMENT, SURFACE ACOUSTIC WAVE DEVICE, AND METHOD OF MANUFACTURING BONDED SUBSTRATE
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Assignees
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| 11-1, OSAKI 1-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 141-0032 |
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| 104 TOTSUKAMACHI 1-CHOME |
| SHINJUKU-KU, TOKYO, JAPAN 169-8050 |
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| 4-4-37, TAKEDA |
| KOFU-SHI, YAMANASHI, JAPAN 400-8510 |
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Correspondence name and address
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HOLTZ, HOLTZ, & VOLEK PC
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630 NINTH AVENUE
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SUITE 1010
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NEW YORK, NY 10036-3744
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