Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 041285/0469 | |
| Pages: | 5 |
| | Recorded: | 02/17/2017 | | |
| Attorney Dkt #: | 1420149.542US9 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/07/2019
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Application #:
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15504763
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Filing Dt:
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02/17/2017
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Publication #:
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Pub Dt:
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09/21/2017
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Title:
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BONDED BODY, POWER MODULE SUBSTRATE WITH HEAT SINK, HEAT SINK, METHOD OF MANUFACTURING BONDED BODY, METHOD OF MANUFACTURING POWER MODULE SUBSTRATE WITH HEAT SINK, AND METHOD OF MANUFACTURING HEAT SINK
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Assignee
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| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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Correspondence name and address
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LOCKE LORD LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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