Patent Assignment Details
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| Reel/Frame: | 041306/0647 | |
| Pages: | 7 |
| | Recorded: | 01/09/2017 | | |
| Attorney Dkt #: | MEMSC-017XX |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S STATE OF INCORPORATION PREVIOUSLY RECORDED AT REEL: 018283 FRAME: 0221. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/24/2009
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Application #:
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11505046
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Filing Dt:
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08/16/2006
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Publication #:
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Pub Dt:
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12/07/2006
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Title:
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METHOD OF WAFER-LEVEL PACKAGING USING LOW-ASPECT RATIO THROUGH-WAFER HOLES
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Assignee
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| 800 TURNPIKE STREET |
| SUITE 202 |
| NORTH ANDOVER, MASSACHUSETTS 01845 |
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Correspondence name and address
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PRETI FLAHERTY BELIVEAU & PACHIOS LLP
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60 STATE STREET
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BOSTON, MA 02109
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